Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6634930 | Method and apparatus for preventing metal corrosion during chemical mechanical polishing | Wen-Chih Chiou, Tsu Shih, Syun-Ming Jang, Chia-Ming Yang | 2003-10-21 |
| 6635211 | Reinforced polishing pad for linear chemical mechanical polishing and method for forming | Wen-Chih Chiou, Tsu Shih, Syun-Ming Jang | 2003-10-21 |
| 6620034 | Way to remove Cu line damage after Cu CMP | Tsu Shih, Jih-Churng Jwu, Syun-Ming Jang | 2003-09-16 |
| 6620725 | Reduction of Cu line damage by two-step CMP | Shau-Lin Shue, Ming-Hsing Tsai, Wen-Jye Tsai, Tsu Shih, Jih-Churng Twu +1 more | 2003-09-16 |
| 6589872 | Use of low-high slurry flow to eliminate copper line damages | Jih-Churng Twu, Tsu Shih, Syun-Ming Jang | 2003-07-08 |
| 6544891 | Method to eliminate post-CMP copper flake defect | Wen-Chih Chiou, Tsu Shih, Syun-Ming Jang | 2003-04-08 |
| 6518183 | Hillock inhibiting method for forming a passivated copper containing conductor layer | Weng Chang, Tien-I Bao, Syun-Ming Jang | 2003-02-11 |