Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660577 | Method for fabricating metal gates in deep sub-micron devices | Sheng-Hsiung Chen | 2003-12-09 |
| 6649513 | Copper back-end-of-line by electropolish | Shih-Wei Chou, Winston Shue, Mong-Song Liang | 2003-11-18 |
| 6620725 | Reduction of Cu line damage by two-step CMP | Shau-Lin Shue, Wen-Jye Tsai, Ying-Ho Chen, Tsu Shih, Jih-Churng Twu +1 more | 2003-09-16 |
| 6573187 | Method of forming dual damascene structure | Sheng-Hsiung Chen | 2003-06-03 |
| 6562725 | Dual damascene structure employing nitrogenated silicon carbide and non-nitrogenated silicon carbide etch stop layers | Ching-Hua Hsieh, Shau-Lin Shue, Chen-Hua Yu | 2003-05-13 |