Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6657284 | Graded dielectric layer and method for fabrication thereof | Lain-Jong Li, Shwang-Ming Jeng, Syun-Ming Jang | 2003-12-02 |
| 6599847 | Sandwich composite dielectric layer yielding improved integrated circuit device reliability | Syun-Ming Jang | 2003-07-29 |
| 6586331 | Low sheet resistance of titanium salicide process | Chung-Shi Liu | 2003-07-01 |
| 6562725 | Dual damascene structure employing nitrogenated silicon carbide and non-nitrogenated silicon carbide etch stop layers | Ming-Hsing Tsai, Ching-Hua Hsieh, Shau-Lin Shue | 2003-05-13 |
| 6562712 | Multi-step planarizing method for forming a patterned thermally extrudable material layer | Chung-Shi Liu | 2003-05-13 |
| 6559040 | Process for polishing the top surface of a polysilicon gate | Chung-Long Chang, Syun-Ming Jang | 2003-05-06 |
| 6544882 | Method to improve reliability of multilayer structures of FSG (F-doped SiO2) dielectric layers and aluminum-copper-TiN layers in integrated circuits | Chung-Shi Liu, Shau-Lin Shue | 2003-04-08 |