Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6620725 | Reduction of Cu line damage by two-step CMP | Ming-Hsing Tsai, Wen-Jye Tsai, Ying-Ho Chen, Tsu Shih, Jih-Churng Twu +1 more | 2003-09-16 |
| 6610592 | Method for integrating low-K materials in semiconductor fabrication | Ming-Hsin Tsai | 2003-08-26 |
| 6576543 | Method for selectively depositing diffusion barriers | Jing-Cheng Lin | 2003-06-10 |
| 6562725 | Dual damascene structure employing nitrogenated silicon carbide and non-nitrogenated silicon carbide etch stop layers | Ming-Hsing Tsai, Ching-Hua Hsieh, Chen-Hua Yu | 2003-05-13 |
| 6551915 | Thermal annealing/hydrogen containing plasma method for forming structurally stable low contact resistance damascene conductor structure | Jing-Cheng Lin | 2003-04-22 |
| 6544882 | Method to improve reliability of multilayer structures of FSG (F-doped SiO2) dielectric layers and aluminum-copper-TiN layers in integrated circuits | Chung-Shi Liu, Chen-Hua Yu | 2003-04-08 |
| 6531389 | Method for forming incompletely landed via with attenuated contact resistance | Mei-Yun Wang | 2003-03-11 |