Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649513 | Copper back-end-of-line by electropolish | Ming-Hsing Tsai, Shih-Wei Chou, Mong-Song Liang | 2003-11-18 |
| 6627527 | Method to reduce metal silicide void formation | Maureen Wang, Chi-Wei Chang | 2003-09-30 |
| 6555474 | Method of forming a protective layer included in metal filled semiconductor features | Cheng-Lin Huang, Minghsing Tsai, Mong-Song Liang | 2003-04-29 |