Issued Patents 2003
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670634 | Silicon carbide interconnect for semiconductor components | Salman Akram | 2003-12-30 |
| 6662243 | Memory unit, a method of assembling a memory unit, a method of reconfiguring a system, and a memory device | Warren M. Farnworth | 2003-12-09 |
| 6661104 | Microelectronic assembly with pre-disposed fill material and associated method of manufacture | Tongbi Jiang, Jason L. Fuller | 2003-12-09 |
| 6656754 | Method of forming a semiconductor chip carrier | Warren M. Farnworth, Derek Gochnour | 2003-12-02 |
| 6649444 | Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures | Warren M. Earnworth | 2003-11-18 |
| 6647620 | Method of making center bond flip chip semiconductor carrier | Tongbi Jiang | 2003-11-18 |
| 6646458 | Apparatus for forming coaxial silicon interconnects | Salman Akram, David R. Hembree | 2003-11-11 |
| 6642730 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Derek Gochnour, John O. Jacobson +2 more | 2003-11-04 |
| 6639416 | Method and apparatus for testing semiconductor dice | Salman Akram, David R. Hembree, Warren M. Farnworth | 2003-10-28 |
| 6634100 | Interposer and methods for fabricating same | Salman Akram, Warren M. Farnworth | 2003-10-21 |
| 6630365 | Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures | Warren M. Farnworth | 2003-10-07 |
| 6619532 | Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Warren M. Farnworth | 2003-09-16 |
| 6620731 | Method for fabricating semiconductor components and interconnects with contacts on opposing sides | Warren M. Farnworth, David R. Hembree | 2003-09-16 |
| 6620706 | Condensed memory matrix | Rich Fogal | 2003-09-16 |
| 6614104 | Stackable semiconductor package having conductive layer and insulating layers | Warren M. Farnworth, Mike Brooks | 2003-09-02 |
| 6599776 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Warren M. Farnworth | 2003-07-29 |
| 6600171 | Semiconductor component and system for fabricating contacts on semiconductor components | Warren M. Farnworth, Douglas Kelly | 2003-07-29 |
| 6597066 | Hermetic chip and method of manufacture | Warren M. Farnworth, Salman Akram | 2003-07-22 |
| 6583635 | Semiconductor die test carrier having conductive elastomeric interposer | David R. Hembree | 2003-06-24 |
| 6576495 | Microelectronic assembly with pre-disposed fill material and associated method of manufacture | Tongbi Jiang, Jason L. Fuller | 2003-06-10 |
| 6570251 | Under bump metalization pad and solder bump connections | Salman Akram | 2003-05-27 |
| 6563215 | Silicon carbide interconnect for semiconductor components and method of fabrication | Salman Akram | 2003-05-13 |
| 6562637 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Warren M. Farnworth | 2003-05-13 |
| 6555399 | Double-packaged multichip semiconductor module | Eugene H. Cloud, Larry D. Kinsman | 2003-04-29 |
| 6553276 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2003-04-22 |