Issued Patents 2003
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670818 | Method for aligning and connecting semiconductor components to substrates | — | 2003-12-30 |
| 6648654 | Electrical connector | Salman Akram, Warren M. Farnworth | 2003-11-18 |
| 6646458 | Apparatus for forming coaxial silicon interconnects | Salman Akram, Alan G. Wood | 2003-11-11 |
| 6642730 | Test carrier with molded interconnect for testing semiconductor components | Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour, John O. Jacobson +2 more | 2003-11-04 |
| 6639416 | Method and apparatus for testing semiconductor dice | Salman Akram, Alan G. Wood, Warren M. Farnworth | 2003-10-28 |
| 6631662 | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2003-10-14 |
| 6630371 | Chip on board and heat sink attachment methods | — | 2003-10-07 |
| 6630836 | CSP BGA test socket with insert | Warren M. Farnworth, Derek Gochnour | 2003-10-07 |
| 6628128 | CSP BGA test socket with insert and method | Warren M. Farnworth, Derek Gochnour | 2003-09-30 |
| 6620633 | Method for testing bumped semiconductor components | Jorge L. de Varona | 2003-09-16 |
| 6620731 | Method for fabricating semiconductor components and interconnects with contacts on opposing sides | Warren M. Farnworth, Alan G. Wood | 2003-09-16 |
| 6619532 | Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | Michael E. Hess, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2003-09-16 |
| 6617687 | Method of forming a test insert for interfacing a device containing contact bumps with a test substrate | Salman Akram | 2003-09-09 |
| 6614003 | Method and process of contact to a heat softened solder ball array | Warren M. Farnworth | 2003-09-02 |
| 6605205 | Method for continuous processing of semiconductor wafers | Salman Akram | 2003-08-12 |
| 6598290 | Method of making a spring element for use in an apparatus for attaching to a semiconductor | Salman Akram, Derek Gochnour | 2003-07-29 |
| 6600334 | Force applying probe card and test system for semiconductor wafers | Warren M. Farnworth, James M. Wark | 2003-07-29 |
| 6596565 | Chip on board and heat sink attachment methods | — | 2003-07-22 |
| 6589594 | Method for filling a wafer through-via with a conductive material | — | 2003-07-08 |
| 6583635 | Semiconductor die test carrier having conductive elastomeric interposer | Alan G. Wood | 2003-06-24 |
| 6578458 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2003-06-17 |
| 6574858 | Method of manufacturing a chip package | — | 2003-06-10 |
| 6562545 | Method of making a socket assembly for use with a solder ball | Salman Akram | 2003-05-13 |
| 6553276 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, Michael E. Hess, John O. Jacobson +2 more | 2003-04-22 |
| 6543267 | Apparatus and methods for substantial planarization of solder bumps | — | 2003-04-08 |