Issued Patents 2003
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656754 | Method of forming a semiconductor chip carrier | Warren M. Farnworth, Alan G. Wood | 2003-12-02 |
| 6642730 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, John O. Jacobson +2 more | 2003-11-04 |
| 6631662 | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2003-10-14 |
| 6630836 | CSP BGA test socket with insert | Warren M. Farnworth, David R. Hembree | 2003-10-07 |
| 6628128 | CSP BGA test socket with insert and method | Warren M. Farnworth, David R. Hembree | 2003-09-30 |
| 6598290 | Method of making a spring element for use in an apparatus for attaching to a semiconductor | David R. Hembree, Salman Akram | 2003-07-29 |
| 6592670 | Apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Leonard E. Mess | 2003-07-15 |
| 6578458 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2003-06-17 |
| 6555400 | Method for substrate mapping | Warren M. Farnworth | 2003-04-29 |
| 6553276 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2003-04-22 |
| 6544461 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, John O. Jacobson +2 more | 2003-04-08 |
| 6527999 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Leonard E. Mess | 2003-03-04 |