Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6642730 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour +2 more | 2003-11-04 |
| 6627999 | Flip-chip with matched signal lines, ground plane and ground bumps adjacent signal bumps | Salman Akram | 2003-09-30 |
| 6619532 | Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, Warren M. Farnworth, Alan G. Wood | 2003-09-16 |
| 6553276 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2003-04-22 |
| 6551845 | Method of temporarily securing a die to a burn-in carrier | Walter L. Moden | 2003-04-22 |
| 6544461 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour +2 more | 2003-04-08 |
| 6538463 | Semiconductor die and retaining fixture | Walter L. Moden | 2003-03-25 |