Issued Patents 2003
Showing 1–25 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6669738 | Low profile semiconductor package | Larry D. Kinsman | 2003-12-30 |
| 6670634 | Silicon carbide interconnect for semiconductor components | Alan G. Wood | 2003-12-30 |
| 6664589 | Technique to control tunneling currents in DRAM capacitors, cells, and devices | Leonard Forbes | 2003-12-16 |
| 6664130 | Methods of fabricating carrier substrates and semiconductor devices | — | 2003-12-16 |
| 6661103 | Apparatus for packaging flip chip bare die on printed circuit boards | — | 2003-12-09 |
| 6648654 | Electrical connector | David R. Hembree, Warren M. Farnworth | 2003-11-18 |
| 6646286 | Semiconductor substrate-based BGA interconnection | — | 2003-11-11 |
| 6646458 | Apparatus for forming coaxial silicon interconnects | David R. Hembree, Alan G. Wood | 2003-11-11 |
| 6642730 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Warren M. Farnworth, Alan G. Wood, Derek Gochnour, John O. Jacobson +2 more | 2003-11-04 |
| 6639416 | Method and apparatus for testing semiconductor dice | Alan G. Wood, David R. Hembree, Warren M. Farnworth | 2003-10-28 |
| 6640323 | Testing system for evaluating integrated circuits, a testing system, and a method for testing an integrated circuit | — | 2003-10-28 |
| 6635540 | Method for using thin spacers and oxidation in gate oxides | Mohamed A. Ditali | 2003-10-21 |
| 6634100 | Interposer and methods for fabricating same | Alan G. Wood, Warren M. Farnworth | 2003-10-21 |
| 6631662 | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions | Derek Gochnour, Michael E. Hess, David R. Hembree | 2003-10-14 |
| 6627999 | Flip-chip with matched signal lines, ground plane and ground bumps adjacent signal bumps | John O. Jacobson | 2003-09-30 |
| 6628133 | Methods of testing integrated circuitry | — | 2003-09-30 |
| 6624006 | Methods of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip | — | 2003-09-23 |
| 6620654 | Method for fabricating a simplified CMOS polysilicon thin film transistor and resulting structure | — | 2003-09-16 |
| 6617684 | Packaged die on PCB with heat sink encapsulant | James M. Wark | 2003-09-09 |
| 6617687 | Method of forming a test insert for interfacing a device containing contact bumps with a test substrate | David R. Hembree | 2003-09-09 |
| 6617671 | High density stackable and flexible substrate-based semiconductor device modules | — | 2003-09-09 |
| 6613662 | Method for making projected contact structures for engaging bumped semiconductor devices | James M. Wark | 2003-09-02 |
| 6612872 | Apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, David J. Corisis | 2003-09-02 |
| 6612027 | Method for forming metal contacts on a substrate | — | 2003-09-02 |
| 6610591 | Methods of ball grid array | Tongbi Jiang | 2003-08-26 |