Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6631662 | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2003-10-14 |
| 6619532 | Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2003-09-16 |
| 6578458 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2003-06-17 |
| 6553276 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, John O. Jacobson +2 more | 2003-04-22 |