Issued Patents 2003
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6669781 | Method and apparatus for improving stencil/screen print quality | Chad A. Cobbley, John VanNortwick | 2003-12-30 |
| 6664175 | Method of forming ruthenium interconnect for an integrated circuit | Li Li | 2003-12-16 |
| 6662440 | Z-axis electrical contact for microelectric devices | Edward A. Schrock | 2003-12-16 |
| 6661104 | Microelectronic assembly with pre-disposed fill material and associated method of manufacture | Jason L. Fuller, Alan G. Wood | 2003-12-09 |
| 6647620 | Method of making center bond flip chip semiconductor carrier | Alan G. Wood | 2003-11-18 |
| 6646354 | Adhesive composition and methods for use in packaging applications | Chad A. Cobbley, Edward A. Schrock | 2003-11-11 |
| 6641669 | Method and apparatus for improving stencil/screen print quality | Chad A. Cobbley, John VanNortwick | 2003-11-04 |
| 6630400 | Method for electroless plating a contact pad | Li Li | 2003-10-07 |
| 6616864 | Z-axis electrical contact for microelectronic devices | Edward A. Schrock | 2003-09-09 |
| 6610591 | Methods of ball grid array | Salman Akram | 2003-08-26 |
| 6607599 | Apparatus for improving stencil/screen print quality | Chad A. Cobbley, John VanNortwick | 2003-08-19 |
| 6602730 | Method for gravitation-assisted control of spread of viscous material applied to a substrate | Syed Sajid Ahmad | 2003-08-05 |
| 6601294 | Method for making a packaged semiconductor device | Mark S. Johnson | 2003-08-05 |
| 6599365 | Apparatus for improving stencil/screen print quality | Chad A. Cobbley, John VanNortwick | 2003-07-29 |
| 6589812 | Pre-applied adhesion promoter | Brenton L. Dickey | 2003-07-08 |
| 6586277 | Method and structure for manufacturing improved yield semiconductor packaged devices | — | 2003-07-01 |
| 6582994 | Passivation layer for packaged integrated circuits | Zhiping Yin | 2003-06-24 |
| 6579744 | Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive | — | 2003-06-17 |
| 6576495 | Microelectronic assembly with pre-disposed fill material and associated method of manufacture | Jason L. Fuller, Alan G. Wood | 2003-06-10 |
| 6566253 | Method of making electrical interconnection for attachment to a substrate | — | 2003-05-20 |
| 6562277 | Method and apparatus for attaching a workpiece to a workpiece support | Ed A. Schrock | 2003-05-13 |
| 6561044 | High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles | Zhigiang Wu | 2003-05-13 |
| 6551863 | Flip chip dip coating encapsulant | Farrah J. Johnson | 2003-04-22 |
| 6548764 | Semiconductor packages and methods for making the same | Casey Prindiville, Bret K. Street | 2003-04-15 |
| 6548376 | Methods of thinning microelectronic workpieces | — | 2003-04-15 |