Issued Patents 2003
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6669781 | Method and apparatus for improving stencil/screen print quality | Tongbi Jiang, John VanNortwick | 2003-12-30 |
| 6660558 | Semiconductor package with molded flash | Todd O. Bolken, David L. Peters, Patrick W. Tandy | 2003-12-09 |
| 6646354 | Adhesive composition and methods for use in packaging applications | Tongbi Jiang, Edward A. Schrock | 2003-11-11 |
| 6641669 | Method and apparatus for improving stencil/screen print quality | Tongbi Jiang, John VanNortwick | 2003-11-04 |
| 6607599 | Apparatus for improving stencil/screen print quality | Tongbi Jiang, John VanNortwick | 2003-08-19 |
| 6599365 | Apparatus for improving stencil/screen print quality | Tongbi Jiang, John VanNortwick | 2003-07-29 |
| 6595408 | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement | Michael B. Ball, Marjorie L. Waddel | 2003-07-22 |
| 6584897 | Method and stencil for extruding material on a substrate | Ford B. Grigg | 2003-07-01 |
| 6572444 | Apparatus and methods of automated wafer-grinding using grinding surface position monitoring | Michael B. Ball | 2003-06-03 |
| 6559537 | Ball grid array packages with thermally conductive containers | Todd O. Bolken | 2003-05-06 |
| 6558600 | Method for packaging microelectronic substrates | Vernon Williams | 2003-05-06 |
| 6551917 | Method of locating conductive spheres utilizing screen and hopper of solder balls | Michael B. Ball, Marjorie L. Waddel | 2003-04-22 |
| 6545498 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2003-04-08 |
| 6537400 | Automated method of attaching flip chip devices to a substrate | Rich Fogal, John VanNortwick | 2003-03-25 |
| 6533159 | Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux | Michael B. Ball, Marjorie L. Waddel | 2003-03-18 |
| 6521287 | Method for manufacturing improved stencil/screen | Tongbi Jiang, John VanNortwick | 2003-02-18 |
| 6518654 | Packages for semiconductor die | Todd O. Bolken, Cary J. Baerlocher, David J. Corisis | 2003-02-11 |