Issued Patents 2003
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664139 | Method and apparatus for packaging a microelectronic die | — | 2003-12-16 |
| 6660558 | Semiconductor package with molded flash | David L. Peters, Patrick W. Tandy, Chad A. Cobbley | 2003-12-09 |
| 6653173 | Method and apparatus for packaging a microelectronic die | — | 2003-11-25 |
| 6644949 | Apparatus for reduced flash encapsulation of microelectronic devices | Brad D. Rumsey, Cary J. Baerlocher | 2003-11-11 |
| 6638595 | Method and apparatus for reduced flash encapsulation of microelectronic devices | Brad D. Rumsey, Cary J. Baerlocher | 2003-10-28 |
| 6605331 | Asymmetric transfer molding method and an asymmetric encapsulation made therefrom | Mark S. Johnson | 2003-08-12 |
| 6589820 | Method and apparatus for packaging a microelectronic die | — | 2003-07-08 |
| 6576496 | Method and apparatus for encapsulating a multi-chip substrate array | David L. Peters | 2003-06-10 |
| 6573592 | Semiconductor die packages with standard ball grid array footprint and method for assembling the same | — | 2003-06-03 |
| 6559537 | Ball grid array packages with thermally conductive containers | Chad A. Cobbley | 2003-05-06 |
| 6538311 | Two-stage transfer molding method to encapsulate MMC module | — | 2003-03-25 |
| 6537853 | Overmolding encapsulation process | Mark S. Johnson | 2003-03-25 |
| 6531763 | Interposers having encapsulant fill control features | David J. Corisis | 2003-03-11 |
| 6521980 | Controlling packaging encapsulant leakage | Patrick W. Tandy, Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis +2 more | 2003-02-18 |
| 6518654 | Packages for semiconductor die | Cary J. Baerlocher, David J. Corisis, Chad A. Cobbley | 2003-02-11 |
| 6503781 | Molded ball grid array | William R. Stephenson, Bret K. Street | 2003-01-07 |