Issued Patents 2003
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660558 | Semiconductor package with molded flash | Todd O. Bolken, David L. Peters, Chad A. Cobbley | 2003-12-09 |
| 6658727 | Method for assembling die package | — | 2003-12-09 |
| 6657288 | Compression layer on the lead frame to reduce stress defects | — | 2003-12-02 |
| 6577004 | Solder ball landpad design to improve laminate performance | Brad D. Rumsey, William Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more | 2003-06-10 |
| 6553658 | Assembling a stacked die package | — | 2003-04-29 |
| 6542720 | Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices | — | 2003-04-01 |
| 6537051 | Encapsulation mold with a castellated inner surface | — | 2003-03-25 |
| 6521980 | Controlling packaging encapsulant leakage | Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken +2 more | 2003-02-18 |