Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6577004 | Solder ball landpad design to improve laminate performance | Brad D. Rumsey, Patrick W. Tandy, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more | 2003-06-10 |
| 6577019 | Alignment and orientation features for a semiconductor package | Stuart L. Roberts, Leonard E. Mess | 2003-06-10 |