Issued Patents 2003
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650007 | Stackable ceramic fbga for high thermal applications | Walter L. Moden, David J. Corisis, Larry D. Kinsman | 2003-11-18 |
| 6592670 | Apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Derek Gochnour | 2003-07-15 |
| 6577019 | Alignment and orientation features for a semiconductor package | Stuart L. Roberts, William Reeder | 2003-06-10 |
| 6563217 | Module assembly for stacked BGA packages | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2003-05-13 |
| 6558966 | Apparatus and methods of packaging and testing die | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2003-05-06 |
| 6527999 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Derek Gochnour | 2003-03-04 |
| 6525943 | Heat sink with alignment and retaining features | Walter L. Moden, David J. Corisis, Larry D. Kinsman | 2003-02-25 |
| 6512302 | Apparatus and methods of packaging and testing die | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2003-01-28 |