DS

Dana A. Stoddard

Micron: 1 patents #445 of 831Top 55%
📍 Boise, ID: #281 of 574 inventorsTop 50%
🗺 Idaho: #449 of 1,039 inventorsTop 45%
Overall (2003): #238,956 of 273,478Top 90%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6577004 Solder ball landpad design to improve laminate performance Brad D. Rumsey, Patrick W. Tandy, William Reeder, Stephen F. Moxham, Steven G. Thummel +1 more 2003-06-10