Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6671182 | Soldermask opening to prevent delamination | — | 2003-12-30 |
| 6668449 | Method of making a semiconductor device having an opening in a solder mask | Matt E. Schwab | 2003-12-30 |
| 6644949 | Apparatus for reduced flash encapsulation of microelectronic devices | Todd O. Bolken, Cary J. Baerlocher | 2003-11-11 |
| 6638595 | Method and apparatus for reduced flash encapsulation of microelectronic devices | Todd O. Bolken, Cary J. Baerlocher | 2003-10-28 |
| 6634099 | Soldermask opening to prevent delamination | — | 2003-10-21 |
| 6577015 | Partial slot cover for encapsulation process | — | 2003-06-10 |
| 6577004 | Solder ball landpad design to improve laminate performance | Patrick W. Tandy, William Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more | 2003-06-10 |
| 6521980 | Controlling packaging encapsulant leakage | Patrick W. Tandy, Joseph Brand, Steven R. Stephenson, David J. Corisis, Todd O. Bolken +2 more | 2003-02-18 |
| 6518678 | Apparatus and method for reducing interposer compression during molding process | Stephen James | 2003-02-11 |