Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6632575 | Precision fiducial | — | 2003-10-14 |
| 6605331 | Asymmetric transfer molding method and an asymmetric encapsulation made therefrom | Todd O. Bolken | 2003-08-12 |
| 6601294 | Method for making a packaged semiconductor device | Tongbi Jiang | 2003-08-05 |
| 6549821 | Stereolithographic method and apparatus for packaging electronic components and resulting structures | Warren M. Farnworth | 2003-04-15 |
| 6541856 | Thermally enhanced high density semiconductor package | David J. Corisis, Mike Brooks, Larry D. Kinsman | 2003-04-01 |
| 6537853 | Overmolding encapsulation process | Todd O. Bolken | 2003-03-25 |