Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6662440 | Z-axis electrical contact for microelectric devices | Tongbi Jiang | 2003-12-16 |
| 6646354 | Adhesive composition and methods for use in packaging applications | Chad A. Cobbley, Tongbi Jiang | 2003-11-11 |
| 6616864 | Z-axis electrical contact for microelectronic devices | Tongbi Jiang | 2003-09-09 |
| 6541872 | Multi-layered adhesive for attaching a semiconductor die to a substrate | Tongbi Jiang | 2003-04-01 |
| 6521980 | Controlling packaging encapsulant leakage | Patrick W. Tandy, Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis +2 more | 2003-02-18 |