Issued Patents 2003
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6544820 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Jerrold L. King | 2003-04-08 |
| 6545498 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2003-04-08 |
| 6544864 | METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS | W. Jeff Reeder | 2003-04-08 |
| 6541872 | Multi-layered adhesive for attaching a semiconductor die to a substrate | Edward A. Schrock | 2003-04-01 |
| 6539815 | High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles | Zhigiang Wu | 2003-04-01 |
| 6539286 | Fluid level sensor | — | 2003-03-25 |
| 6538898 | Method and apparatus of die attachment for BOC and F/C surface mount | Casey L. Prindivill | 2003-03-25 |
| 6531340 | Low temperature die attaching material for BOC packages | — | 2003-03-11 |
| 6524891 | Method of pressure curing for reducing voids in a die attach bondline and applications thereof | — | 2003-02-25 |
| 6520030 | High resolution pressure sensing device having an insulating flexible matrix loaded with filler particles | Zhiqiang Wu | 2003-02-18 |
| 6521287 | Method for manufacturing improved stencil/screen | Chad A. Cobbley, John VanNortwick | 2003-02-18 |
| 6518094 | Center bond flip-chip semiconductor device and method of making it | Alan G. Wood | 2003-02-11 |
| 6515355 | Passivation layer for packaged integrated circuits | Zhiping Yin | 2003-02-04 |
| 6514795 | Packaged stacked semiconductor die and method of preparing same | Michael Connell | 2003-02-04 |
| 6508890 | Method of enhancing the conductivity of a conductive surface | Li Li | 2003-01-21 |
| 6506628 | Method of attaching a leadframe to singulated semiconductor dice | Syed Sajid Ahmad, Walter L. Moden | 2003-01-14 |