Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670720 | Semiconductor chip package with alignment structure | Leland R. Nevill | 2003-12-30 |
| 6656767 | Method of forming a stack of packaged memory dice | Jerry M. Brooks | 2003-12-02 |
| 6590277 | Reduced stress LOC assembly | Larry D. Kinsman, Jerry M. Brooks, David J. Corisis | 2003-07-08 |
| 6570771 | Single-piece molded module housing | Warren M. Farnworth | 2003-05-27 |
| 6559519 | Integrated circuit device having cyanate ester buffer coat and method of fabricating same | J. Mike Brooks, Kevin Schofield | 2003-05-06 |
| 6544820 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Tongbi Jiang | 2003-04-08 |
| 6531339 | Redundancy mapping in a multichip semiconductor package | Jerry M. Brooks | 2003-03-11 |