Issued Patents 2003
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670702 | Stackable ball grid array package | David J. Corisis, Walter L. Moden | 2003-12-30 |
| 6656767 | Method of forming a stack of packaged memory dice | Jerrold L. King | 2003-12-02 |
| 6648663 | Locking assembly for securing semiconductor device to carrier substrate | David J. Corisis, Terry R. Lee | 2003-11-18 |
| 6635954 | Stress reduction feature for LOC lead frame | Larry D. Kinsman, Timothy J. Allen | 2003-10-21 |
| 6630733 | Integrated circuit package electrical enhancement | David J. Corisis | 2003-10-07 |
| 6617198 | Semiconductor assembly without adhesive fillets | — | 2003-09-09 |
| 6611058 | Vertical surface mount assembly and methods | Larry D. Kinsman, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2003-08-26 |
| 6610162 | Methods for stress reduction feature for LOC lead frame | Larry D. Kinsman, Timothy J. Allen | 2003-08-26 |
| 6603198 | Semiconductor structure having stacked semiconductor devices | Salman Akram | 2003-08-05 |
| 6590277 | Reduced stress LOC assembly | Jerrold L. King, Larry D. Kinsman, David J. Corisis | 2003-07-08 |
| 6583503 | Semiconductor package with stacked substrates and multiple semiconductor dice | Salman Akram | 2003-06-24 |
| 6577503 | Vertical surface mount apparatus with thermal carrier | Larry D. Kinsman, Walter L. Moden | 2003-06-10 |
| 6576987 | Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die | Aaron Schoenfeld | 2003-06-10 |
| 6570244 | Multi-part lead frame with dissimilar materials | S. Hinkle, David J. Corisis | 2003-05-27 |
| 6565374 | Locking assembly for securing semiconductor device to carrier substrate | David J. Corisis, Terry R. Lee | 2003-05-20 |
| 6563192 | Semiconductor die with integral decoupling capacitor | David J. Corisis | 2003-05-13 |
| 6549421 | Stackable ball grid array package | David J. Corisis, Walter L. Moden | 2003-04-15 |
| 6545343 | Hybrid frame with lead-lock tape | Larry D. Kinsman, Timothy J. Allen | 2003-04-08 |
| 6531338 | Method of manufacturing a semiconductor structure having stacked semiconductor devices | Salman Akram | 2003-03-11 |
| 6531339 | Redundancy mapping in a multichip semiconductor package | Jerrold L. King | 2003-03-11 |
| 6531337 | Method of manufacturing a semiconductor structure having stacked semiconductor devices | Salman Akram | 2003-03-11 |
| 6518650 | Tape under frame for lead frame IC package assembly | David J. Corisis, Larry D. Kinsman | 2003-02-11 |
| 6506629 | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages | Larry D. Kinsman | 2003-01-14 |