Issued Patents 2003
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6548392 | Methods of a high density flip chip memory arrays | Salman Akram, Warren M. Farnworth | 2003-04-15 |
| 6544461 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Derek Gochnour, John O. Jacobson +2 more | 2003-04-08 |
| 6541303 | Method for conducting heat in a flip-chip assembly | Salman Akram | 2003-04-01 |
| 6538334 | High density flip chip memory arrays | Salman Akram, Warren M. Farnworth | 2003-03-25 |
| 6535012 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2003-03-18 |
| 6535393 | Electrical device allowing for increased device densities | Salman Akram, Warren M. Farnworth, J. Michael Brooks, Eugene H. Cloud | 2003-03-18 |
| 6531345 | Method and apparatus for fabricating electronic device | Warren M. Farnworth, Kevin G. Duesman | 2003-03-11 |
| 6529027 | Interposer and methods for fabricating same | Salman Akram, Warren M. Farnworth | 2003-03-04 |
| 6521995 | Wafer-level package | Salman Akram | 2003-02-18 |
| 6518094 | Center bond flip-chip semiconductor device and method of making it | Tongbi Jiang | 2003-02-11 |
| 6519658 | Memory unit and method of assembling a computer | Warren M. Farnworth | 2003-02-11 |
| 6509647 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Warren M. Farnworth | 2003-01-21 |