Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6636068 | Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer | Warren M. Farnworth, William K. Waller, Leland R. Nevill, Raymond J. Beffa | 2003-10-21 |
| 6622224 | Internal buffered bus for a drum | — | 2003-09-16 |
| 6586835 | Compact system module with built-in thermoelectric cooling | Kie Y. Ahn, Leonard Forbes | 2003-07-01 |
| 6570248 | Structure and method for a high-performance electronic packaging assembly | Kie Y. Ahn, Leonard Forbes | 2003-05-27 |
| 6555399 | Double-packaged multichip semiconductor module | Alan G. Wood, Larry D. Kinsman | 2003-04-29 |
| 6535393 | Electrical device allowing for increased device densities | Salman Akram, Warren M. Farnworth, Alan G. Wood, J. Michael Brooks | 2003-03-18 |
| 6534785 | Reduced terminal testing system | Warren M. Farnworth, Leland R. Nevill, Raymond J. Beffa | 2003-03-18 |
| 6525413 | Die to die connection method and assemblies and packages including dice so connected | Paul A. Farrar | 2003-02-25 |
| 6521958 | MOSFET technology for programmable address decode and correction | Leonard Forbes, Wendell P. Noble | 2003-02-18 |