WT

William R. Tonti

IBM: 23 patents #8 of 5,539Top 1%
Infineon Technologies Ag: 1 patents #298 of 897Top 35%
📍 South Burlington, VT: #1 of 169 inventorsTop 1%
🗺 Vermont: #2 of 578 inventorsTop 1%
Overall (2003): #138 of 273,478Top 1%
23
Patents 2003

Issued Patents 2003

Showing 1–23 of 23 patents

Patent #TitleCo-InventorsDate
6649935 Self-aligned, planarized thin-film transistors, devices employing the same Louis L. Hsu, Jack A. Mandelman, Li-Kong Wang 2003-11-18
6646949 Word line driver for dynamic random access memories Wayne F. Ellis, Louis L. Hsu, Jack A. Mandelman 2003-11-11
6642584 Dual work function semiconductor structure with borderless contact and method of fabricating the same Qiuyi Ye, Yujun Li 2003-11-04
6635543 SOI hybrid structure with selective epitaxial growth of silicon Toshiharu Furukawa, Jack A. Mandelman, Dan Moy, Byeongju Park 2003-10-21
6633055 Electronic fuse structure and method of manufacturing Claude L. Bertin, Erik L. Hedberg, Max G. Levy, Timothy D. Sullivan 2003-10-14
6624031 Test structure and methodology for semiconductor stress-induced defects and antifuse based on same test structure Wagdi W. Abadeer, Eric Adler, Jeffrey S. Brown, Robert J. Gauthier, Jr., Jonathan M. McKenna +2 more 2003-09-23
6621324 Redundant antifuse segments for improved programming efficiency John A. Fifield 2003-09-16
6611050 Chip edge interconnect apparatus and method Thomas G. Ference, Wayne J. Howell, Richard Q. Williams 2003-08-26
6596592 Structures and methods of anti-fuse formation in SOI Claude L. Bertin, Ramachandra Divakaruni, Russell J. Houghton, Jack A. Mandelman 2003-07-22
6590258 SIO stacked DRAM logic Ramachandra Divakauni, Mark C. Hakey, William H. Ma, Jack A. Mandclman 2003-07-08
6580650 DRAM word line voltage control to insure full cell writeback level Wayne F. Ellis, Russell J. Houghton, Mark D. Jacunski, Thomas M. Maffitt 2003-06-17
6577156 Method and apparatus for initializing an integrated circuit using compressed data from a remote fusebox Darren L. Anand, John E. Barth, Jr., John A. Fifield, Pamela S. Gillis, Peter O. Jakobsen +4 more 2003-06-10
6574763 Method and apparatus for semiconductor integrated circuit testing and burn-in Claude L. Bertin, Erik L. Hedberg, Russell J. Houghton 2003-06-03
6570207 Structure and method for creating vertical capacitor and anti-fuse in DRAM process employing vertical array device cell complex Louis L. Hsu, Jack A. Mandelman, Carl Radens 2003-05-27
6566191 Forming electronic structures having dual dielectric thicknesses and the structure so formed Louis L. Hsu, Jack A. Mandelman, Carl Radens, Richard Strub 2003-05-20
6563736 Flash memory structure having double celled elements and method for fabricating the same Louis L. Hsu, Rajiv V. Joshi, Carl Radens, Jack A. Mandelman 2003-05-13
6555891 SOI hybrid structure with selective epitaxial growth of silicon Toshiharu Furukawa, Jack A. Mandelman, Dan Moy, Byeongju Park 2003-04-29
6544837 SOI stacked DRAM logic Ramachandra Divakauni, Mark C. Hakey, William H. Ma, Jack A. Mandelman 2003-04-08
6541837 Charge-coupled device wafer cover plate with compact interconnect wiring Claude L. Bertin, Albert Kao, Jerzy M. Zalesinski 2003-04-01
6538295 Salicide device with borderless contact Gary B. Bronner, Jeffrey P. Gambino, Louis L. Hsu, Jack A. Mandelman, Carl Radens 2003-03-25
6531410 Intrinsic dual gate oxide MOSFET using a damascene gate process Claude L. Bertin, Anthony J. Dally, John A. Fifield, John Jesse Higgins, Jack A. Mandelman +1 more 2003-03-11
6528855 MOSFET having a low aspect ratio between the gate and the source/drain Qiuyi Ye, Yujun Li, Jack A. Mandelman 2003-03-04
6518641 Deep slit isolation with controlled void Jack A. Mandelman, Ramachandra Divakaruni, Johnathan E. Faltermeier 2003-02-11