CR

Carl Radens

IBM: 21 patents #11 of 5,539Top 1%
Infineon Technologies Ag: 4 patents #53 of 897Top 6%
📍 Lagrangeville, NY: #1 of 31 inventorsTop 4%
🗺 New York: #5 of 9,423 inventorsTop 1%
Overall (2003): #185 of 273,478Top 1%
22
Patents 2003

Issued Patents 2003

Showing 1–22 of 22 patents

Patent #TitleCo-InventorsDate
6670234 Method of integrating volatile and non-volatile memory cells on the same substrate and a semiconductor memory device thereof Louis L. Hsu, Li-Kong Wang 2003-12-30
6664161 Method and structure for salicide trench capacitor plate electrode Michael P. Chudzik, Jack A. Mandelman, Rajarao Jammy, Kenneth T. Settlemyer, Jr., Padraic Shafer +1 more 2003-12-16
6632741 Self-trimming method on looped patterns Lawrence A. Clevenger, Louis L. Hsu, Jack A. Mandelman 2003-10-14
6630379 Method of manufacturing 6F2 trench capacitor DRAM cell having vertical MOSFET and 3F bitline pitch Jack A. Mandelman, Ramachandra Divakaruni, Ulrike Gruening 2003-10-07
6617702 Semiconductor device utilizing alignment marks for globally aligning the front and back sides of a semiconductor substrate Louis L. Hsu, Rajiv V. Joshi, Jack A. Mandelman, Tsorng-Dih Yuan 2003-09-09
6580136 Method for delineation of eDRAM support device notched gate Jack A. Mandelman 2003-06-17
6576945 Structure and method for a compact trench-capacitor DRAM cell with body contact Jack A. Mandelman 2003-06-10
6573137 Single sided buried strap Ramachandra Divakaruni, Jack A. Mandelman, Wolfgang Bergner, Gary B. Bronner, Ulrike Gruening +5 more 2003-06-03
6570208 6F2 Trench EDRAM cell with double-gated vertical MOSFET and self-aligned STI Jack A. Mandelman, Ramachandra Divakaruni, Gary B. Bronner 2003-05-27
6570207 Structure and method for creating vertical capacitor and anti-fuse in DRAM process employing vertical array device cell complex Louis L. Hsu, Jack A. Mandelman, William R. Tonti 2003-05-27
6566238 Metal wire fuse structure with cavity Axel Brintzinger, Edward W. Kiewra, Chandrasekhar Narayan 2003-05-20
6566177 Silicon-on-insulator vertical array device trench capacitor DRAM Gary B. Bronner, Tze-Chiang Chen, Bijan Davari, Jack A. Mandelman, Dan Moy +3 more 2003-05-20
6566191 Forming electronic structures having dual dielectric thicknesses and the structure so formed Louis L. Hsu, Jack A. Mandelman, Richard Strub, William R. Tonti 2003-05-20
6563160 High dielectric constant materials forming components of DRAM such as deep-trench capacitors and gate dielectric (insulators) for support circuits Lawrence A. Clevenger, Louis L. Hsu, Joseph F. Shepard, Jr. 2003-05-13
6563736 Flash memory structure having double celled elements and method for fabricating the same Louis L. Hsu, Rajiv V. Joshi, Jack A. Mandelman, William R. Tonti 2003-05-13
6556477 Integrated chip having SRAM, DRAM and flash memory and method for fabricating the same Louis L. Hsu, Li-Kong Wang 2003-04-29
6541815 High-density dual-cell flash memory structure Jack A. Mandelman, Louis L. Hsu, Chung H. Lam 2003-04-01
6538295 Salicide device with borderless contact Gary B. Bronner, Jeffrey P. Gambino, Louis L. Hsu, Jack A. Mandelman, William R. Tonti 2003-03-25
6518119 Strap with intrinsically conductive barrier Jeffrey P. Gambino, Rajarao Jammy, Jack A. Mandelman 2003-02-11
6518616 Vertical gate top engineering for improved GC and CB process windows Thomas W. Dyer, Stephan Kudelka, Venkatachaiam C. Jaiprakash 2003-02-11
6509624 Semiconductor fuses and antifuses in vertical DRAMS Wolfgang Bergner, Rama Divakaruni, Larry Nesbit 2003-01-21
6509612 High dielectric constant materials as gate dielectrics (insulators) Lawrence A. Clevenger, Louis L. Hsu, Joseph F. Shepard, Jr. 2003-01-21