Issued Patents 2002
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492728 | Vertical surface mount assembly | Larry D. Kinsman, Jerry M. Brooks, Warren M. Farnworth, Terry R. Lee | 2002-12-10 |
| 6489564 | Stress relieving tape bonding interconnect | — | 2002-12-03 |
| 6489186 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, J. Mike Brooks | 2002-12-03 |
| 6486546 | Low profile multi-IC chip package connector | Jerrold L. King, Jerry M. Brooks | 2002-11-26 |
| 6485778 | Method of applying an adhesive material to lead fingers of a lead frame | Syed Sajid Ahmad, Gregory M. Chapman, Tongbi Jiang | 2002-11-26 |
| 6479326 | Heat sink for microchip application | David J. Corisis | 2002-11-12 |
| 6475831 | Methods for a low profile multi-IC chip package connector | Jerrold L. King, Jerry M. Brooks | 2002-11-05 |
| 6455351 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Warren M. Farnworth, Terry R. Lee | 2002-09-24 |
| 6455928 | Stackable ball grid array package | David J. Corisis, Jerry M. Brooks | 2002-09-24 |
| 6455923 | Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices | Tongbi Jiang | 2002-09-24 |
| 6442044 | Semiconductor device socket, assembly and methods | Warren M. Farnworth, Larry D. Kinsman | 2002-08-27 |
| 6437435 | Vertically mountable interposer, assembly and method | Larry D. Kinsman, Warren M. Farnworth | 2002-08-20 |
| 6423579 | Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices | Tongbi Jiang | 2002-07-23 |
| 6419517 | Apparatus and method for packaging circuits | — | 2002-07-16 |
| 6418023 | Vertical surface mount apparatus with thermal carrier | Larry D. Kinsman, Jerry M. Brooks | 2002-07-09 |
| 6414391 | Module assembly for stacked BGA packages with a common bus bar in the assembly | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2002-07-02 |
| 6414374 | Semiconductor device including edge bond pads and methods | Warren M. Farnworth, Larry D. Kinsman | 2002-07-02 |
| 6410406 | Semiconductor device including edge bond pads and methods | Warren M. Farnworth, Larry D. Kinsman | 2002-06-25 |
| 6408509 | Vertically mountable interposer, assembly and method | Larry D. Kinsman, Warren M. Farnworth | 2002-06-25 |
| 6384333 | Underfill coating for LOC package | — | 2002-05-07 |
| 6380631 | Apparatus and methods of packaging and testing die | Leonard E. Mess, David J. Corisis, Larry D. Kinsman | 2002-04-30 |
| 6380756 | Burin carrier and semiconductor die assembly | John O. Jacobson | 2002-04-30 |
| 6365437 | Method of connecting a die in an integrated circuit module | Warren M. Farnworth, Larry D. Kinsman | 2002-04-02 |
| 6362429 | Stress relieving tape bonding interconnect | — | 2002-03-26 |
| 6362519 | Low profile multi-IC chip package connector | Jerrold L. King, Jerry M. Brooks | 2002-03-26 |