Issued Patents 1994
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5362526 | Plasma-enhanced CVD process using TEOS for depositing silicon oxide | John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy, Kenneth S. Collins +3 more | 1994-11-08 |
| 5354387 | Boron phosphorus silicate glass composite layer on semiconductor wafer | Peter Wai-Man Lee, Makoto Nagashima, Kazuto Fukuma, Tetsuya Sato | 1994-10-11 |
| 5354715 | Thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process | John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy, Kenneth S. Collins +3 more | 1994-10-11 |
| 5314845 | Two step process for forming void-free oxide layer over stepped surface of semiconductor wafer | Peter Wai-Man Lee, Makoto Nagashima, Kazuto Fukuma, Tatsuya Sato | 1994-05-24 |
| 5300460 | UHF/VHF plasma for use in forming integrated circuit structures on semiconductor wafers | Kenneth S. Collins, Craig A. Roderick, Chan-Lon Yang, Dan Maydan | 1994-04-05 |
| 5292393 | Multichamber integrated process system | Dan Maydan, Sasson Somekh, David Cheng, Masato Toshima, Isaac Harari +1 more | 1994-03-08 |