Issued Patents All Time
Showing 26–50 of 139 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527547 | Hybrid bonding contact structure of three-dimensional memory device | Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen, Guanping Wu +2 more | 2022-12-13 |
| 11482532 | Joint opening structures of three-dimensional memory devices and methods for forming the same | Wenguang Shi, Guanping Wu, Feng Pan, Xianjin Wan, Baoyou Chen | 2022-10-25 |
| 11462474 | Three-dimensional memory devices having a plurality of NAND strings | Jifeng Zhu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2022-10-04 |
| 11380701 | Memory device and forming method thereof | Yue Qiang Pu, Jin Wen Dong, Jun Chen, Qian Tao, Yushi Hu +5 more | 2022-07-05 |
| 11309327 | Method for forming channel hole plug of three-dimensional memory device | Li Xiao, Qian Tao, Yushi Hu, Jun Chen, Longdong Liu +1 more | 2022-04-19 |
| 11289611 | Three dimensional memory | Hongbin Zhu, Gordon A. Haller, Roger W. Lindsay, Andrew Bicksler, Brian Cleereman +1 more | 2022-03-29 |
| 11276642 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Si Ping Hu | 2022-03-15 |
| 11271004 | Memory device and forming method thereof | Yue Qiang Pu, Jin Wen Dong, Jun Chen, Qian Tao, Yushi Hu +5 more | 2022-03-08 |
| 11264397 | Source structure of three-dimensional memory device and method for forming the same | Yushi Hu, Qian Tao, Jun Chen, Simon Shi-Ning Yang, Steve Weiyi Yang | 2022-03-01 |
| 11211393 | Memory device and forming method thereof | Yue Qiang Pu, Jin Wen Dong, Jun Chen, Qian Tao, Yushi Hu +5 more | 2021-12-28 |
| 11211397 | Three-dimensional memory devices and methods for forming the same | Jun Chen, Jifeng Zhu, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2021-12-28 |
| 11145666 | Staircase structure for memory device | Jun Chen, Xiaowang Dai, Jifeng Zhu, Qian Tao, Yu Ru Huang +6 more | 2021-10-12 |
| 11133325 | Memory cell structure of a three-dimensional memory device | Xiaowang Dai, Jun Chen, Qian Tao, Yushi Hu, Jifeng Zhu +4 more | 2021-09-28 |
| 11101276 | Word line contact structure for three-dimensional memory devices and fabrication methods thereof | Jifeng Zhu, Jun Chen, Si Ping Hu, Xiaowang Dai, Lan Yao +4 more | 2021-08-24 |
| 11088168 | Semiconductor devices and methods of fabrication | Hongbin Zhu, Gordon A. Haller, Jie Sun, Randy J. Koval, John D. Hopkins | 2021-08-10 |
| 11062353 | Method and apparatus for service diversion in connection with mobile payment transactions | Weiwei Ding, Chen Tao, Feng Jin, Jiajun Wen, Yonggang Du +4 more | 2021-07-13 |
| 11056387 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Si Ping Hu | 2021-07-06 |
| 11038946 | Approach for providing access to cloud services on end-user devices using local management of third-party services and conflict checking | Jayasimha Nuggehalli, Bhushan Nadkarni, Srikrishna Narasimhan | 2021-06-15 |
| 11031333 | Three-dimensional memory devices having a plurality of NAND strings | Jifeng Zhu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2021-06-08 |
| 11018149 | Building stacked hollow channels for a three dimensional circuit device | Roger Linsday, Sergei Koveshnikov | 2021-05-25 |
| 10999349 | Approach for providing access to cloud services on end-user devices using direct link integration | Jayasimha Nuggehalli, Bhushan Nadkarni, Srikrishna Narasimhan | 2021-05-04 |
| 10998079 | Structure and method for testing three-dimensional memory device | Jong-jun Kim, Feng Pan, Jong Seuk Lee, Yongna Li, Lidong Song +3 more | 2021-05-04 |
| 10937806 | Through array contact (TAC) for three-dimensional memory devices | Qian Tao, Yushi Hu, Li Xiao, Xiaowang Dai, Yu Ting Zhou +8 more | 2021-03-02 |
| 10930663 | Interconnect structure of three-dimensional memory device | Lidong Song, Yongna Li, Feng Pan, Steve Weiyi Yang, Wenguang Shi | 2021-02-23 |
| 10923491 | Hybrid bonding contact structure of three-dimensional memory device | Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen, Guanping Wu +2 more | 2021-02-16 |