Issued Patents All Time
Showing 26–50 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11271004 | Memory device and forming method thereof | Yue Qiang Pu, Jin Wen Dong, Jun Chen, Zhenyu Lu, Qian Tao +5 more | 2022-03-08 |
| 11264397 | Source structure of three-dimensional memory device and method for forming the same | Zhenyu Lu, Qian Tao, Jun Chen, Simon Shi-Ning Yang, Steve Weiyi Yang | 2022-03-01 |
| 11211397 | Three-dimensional memory devices and methods for forming the same | Zhenyu Lu, Jun Chen, Jifeng Zhu, Qian Tao, Simon Shi-Ning Yang +1 more | 2021-12-28 |
| 11211393 | Memory device and forming method thereof | Yue Qiang Pu, Jin Wen Dong, Jun Chen, Zhenyu Lu, Qian Tao +5 more | 2021-12-28 |
| 11201164 | Memory devices | Akira Goda | 2021-12-14 |
| 11145667 | 3D NAND memory device and method of forming the same | Ruo Fang Zhang, Enbo Wang, Haohao Yang, Qianbing Xu, Fushan Zhang | 2021-10-12 |
| 11133325 | Memory cell structure of a three-dimensional memory device | Xiaowang Dai, Zhenyu Lu, Jun Chen, Qian Tao, Jifeng Zhu +4 more | 2021-09-28 |
| 11081495 | Integrated structures | Justin B. Dorhout, David Daycock, Kunal R. Parekh, Martin C. Roberts | 2021-08-03 |
| 11049866 | Three-dimensional memory devices having through array contacts and methods for forming the same | Mei Lan Guo, Ji Xia, Hongbin Zhu | 2021-06-29 |
| 11031333 | Three-dimensional memory devices having a plurality of NAND strings | Jifeng Zhu, Zhenyu Lu, Jun Chen, Qian Tao, Simon Shi-Ning Yang +1 more | 2021-06-08 |
| 10943920 | Methods of fabricating integrated structures | John Mark Meldrim, Rita J. Klein, John D. Hopkins, Hongbin Zhu, Gordon A. Haller +1 more | 2021-03-09 |
| 10937806 | Through array contact (TAC) for three-dimensional memory devices | Qian Tao, Zhenyu Lu, Li Xiao, Xiaowang Dai, Yu Ting Zhou +8 more | 2021-03-02 |
| 10910390 | Memory device and forming method thereof | Yue Qiang Pu, Jin Wen Dong, Jun Chen, Zhenyu Lu, Qian Tao +5 more | 2021-02-02 |
| 10892274 | Three-dimensional memory devices and fabricating methods thereof | Qian Tao, Haohao Yang, Jin Wen Dong, Jun Chen, Zhenyu Lu | 2021-01-12 |
| 10879071 | Methods of forming assemblies including semiconductor material with heavily-doped and lightly-doped regions | Shu Qin | 2020-12-29 |
| 10879254 | Three-dimensional memory devices having through array contacts and methods for forming the same | Mei Lan Guo, Ji Xia, Hongbin Zhu | 2020-12-29 |
| 10868031 | Multiple-stack three-dimensional memory device and fabrication method thereof | Jun Liu, Zongliang Huo, Li Xiao, Zhenyu Lu, Qian Tao +4 more | 2020-12-15 |
| 10867678 | Three-dimensional memory devices | Jun Chen, Jifeng Zhu, Zhenyu Lu, Jin Wen Dong, Lan Yao | 2020-12-15 |
| 10847528 | Memory cell structure of a three-dimensional memory device | Xiaowang Dai, Zhenyu Lu, Jun Chen, Qian Tao, Jifeng Zhu +4 more | 2020-11-24 |
| 10804279 | Source structure of three-dimensional memory device and method for forming the same | Zhenyu Lu, Qian Tao, Jun Chen, Simon Shi-Ning Yang, Steve Weiyi Yang | 2020-10-13 |
| 10804287 | Three-dimensional memory devices and fabricating methods thereof | Zhenyu Lu, Yu Ru Huang, Qian Tao, Jun Chen, Xiaowang Dai +3 more | 2020-10-13 |
| 10777651 | Gate stacks | John Mark Meldrim, Eric Blomiley, Everett A. McTeer, Matthew J. King | 2020-09-15 |
| 10763099 | Wafer flatness control using backside compensation structure | Xiaowang Dai, Zhenyu Lu, Qian Tao, Ji Xia, Zhaosong Li +1 more | 2020-09-01 |
| 10731273 | Source material for electronic device applications | John Mark Meldrim, Yongjun Jeff Hu, Everett A. McTeer | 2020-08-04 |
| 10658382 | Elevationally-extending string of memory cells individually comprising a programmable charge storage transistor and method of forming an elevationally-extending string of memory cells individually comprising a programmable charge storage transistor | John D. Hopkins, David Daycock, Christopher J. Larsen, Dimitrios Pavlopoulos | 2020-05-19 |