Issued Patents All Time
Showing 51–75 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658378 | Through array contact (TAC) for three-dimensional memory devices | Qian Tao, Zhenyu Lu, Li Xiao, Xiaowang Dai, Yu Ting Zhou +8 more | 2020-05-19 |
| 10644015 | Memory cell structure of a three-dimensional memory device | Xiaowang Dai, Zhenyu Lu, Jun Chen, Qian Tao, Jifeng Zhu +4 more | 2020-05-05 |
| 10566336 | Three-dimensional memory devices having through array contacts and methods for forming the same | Mei Lan Guo, Ji Xia, Hongbin Zhu | 2020-02-18 |
| 10553611 | Memory arrays and methods of fabricating integrated structure | John Mark Meldrim, Rita J. Klein, John D. Hopkins, Hongbin Zhu, Gordon A. Haller +1 more | 2020-02-04 |
| 10515975 | Method for forming dual-deck channel hole structure of three-dimensional memory device | Qian Tao, Zhenyu Lu, Li Xiao, Jun Chen, Xiaowang Dai +4 more | 2019-12-24 |
| 10515972 | Memory cell pillar including source junction plug | Fatma Arzum Simsek-Ege, Krishna K. Parat, Luan C. Tran, Meng-Wei Kuo | 2019-12-24 |
| 10483280 | Method of forming staircase structures for three-dimensional memory device double-sided routing | Li Xiao | 2019-11-19 |
| 10438968 | Memory arrays and methods of fabricating integrated structures | John M. Meldrin, Rita J. Klein, John D. Hopkins, Hongbin Zhu, Gordon A. Haller +1 more | 2019-10-08 |
| 10431591 | NAND memory arrays | Akira Goda | 2019-10-01 |
| 10403631 | Three-dimensional ferroelectric memory devices | Zhenyu Lu, Qian Tao | 2019-09-03 |
| 10355018 | Integrated structures | Justin B. Dorhout, David Daycock, Kunal R. Parekh, Martin C. Roberts | 2019-07-16 |
| 10344398 | Source material for electronic device applications | John Mark Meldrim, Yongjun Jeff Hu, Everett A. McTeer | 2019-07-09 |
| 10340286 | Methods of forming NAND memory arrays | Akira Goda | 2019-07-02 |
| 10283520 | Elevationally-extending string of memory cells individually comprising a programmable charge storage transistor and method of forming an elevationally-extending string of memory cells individually comprising a programmable charge storage transistor | John D. Hopkins, David Daycock, Christopher J. Larsen, Dimitrios Pavlopoulos | 2019-05-07 |
| 10283452 | Three-dimensional memory devices having a plurality of NAND strings | Jifeng Zhu, Zhenyu Lu, Jun Chen, Qian Tao, Simon Shi-Ning Yang +1 more | 2019-05-07 |
| 10256098 | Integrated assemblies containing germanium | Shu Qin | 2019-04-09 |
| 10256249 | Integrated structures | Justin B. Dorhout, David Daycock, Kunal R. Parekh, Martin C. Roberts | 2019-04-09 |
| 10224337 | Memory having a continuous channel | Luan C. Tran, Hongbin Zhu, John D. Hopkins | 2019-03-05 |
| 10164044 | Gate stacks | John Mark Meldrim, Eric Blomiley, Everett A. McTeer, Matthew J. King | 2018-12-25 |
| 10147727 | Conductive structures, wordlines and transistors | Jaydeb Goswami, Zailong Bian, Eric Blomiley, Jaydip Guha, Thomas Gehrke | 2018-12-04 |
| 10147732 | Source structure of three-dimensional memory device and method for forming the same | Zhenyu Lu, Qian Tao, Jun Chen, Simon Shi-Ning Yang, Steve Weiyi Yang | 2018-12-04 |
| 9972628 | Conductive structures, wordlines and transistors | Jaydeb Goswami, Zailong Bian, Eric Blomiley, Jaydip Guha, Thomas Gehrke | 2018-05-15 |
| 9935120 | Methods of fabricating integrated structures | John Mark Meldrim, Rita J. Klein, John D. Hopkins, Hongbin Zhu, Gordon A. Haller +1 more | 2018-04-03 |
| 9859845 | Dual-band signal transmission | Hassan Sarbishaei, Slim Boumaiza | 2018-01-02 |
| 9780102 | Memory cell pillar including source junction plug | Fatma Arzum Simsek-Ege, Krishna K. Parat, Luan C. Tran, Meng-Wei Kuo | 2017-10-03 |