Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11805643 | Method of fabrication thereof a multi-level vertical memory device including inter-level channel connector | Ruo Fang Zhang, Enbo Wang, Haohao Yang, Yushi Hu, Qian Tao | 2023-10-31 |
| 11737263 | 3D NAND memory device and method of forming the same | Ruo Fang Zhang, Enbo Wang, Haohao Yang, Yushi Hu, Fushan Zhang | 2023-08-22 |
| 11716843 | Method for forming contact structures in three-dimensional memory devices | Han Yang, Fanqing Zeng, Fushan Zhang, Enbo Wang | 2023-08-01 |
| 11502094 | Multi-level vertical memory device including inter-level channel connector | Ruo Fang Zhang, Enbo Wang, Haohao Yang, Yushi Hu, Qian Tao | 2022-11-15 |
| 11145667 | 3D NAND memory device and method of forming the same | Ruo Fang Zhang, Enbo Wang, Haohao Yang, Yushi Hu, Fushan Zhang | 2021-10-12 |
| 10937806 | Through array contact (TAC) for three-dimensional memory devices | Qian Tao, Yushi Hu, Zhenyu Lu, Li Xiao, Xiaowang Dai +8 more | 2021-03-02 |
| 10658378 | Through array contact (TAC) for three-dimensional memory devices | Qian Tao, Yushi Hu, Zhenyu Lu, Li Xiao, Xiaowang Dai +8 more | 2020-05-19 |