Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10684246 | On-chip biosensors with nanometer scale glass-like carbon electrodes and improved adhesive coupling | Hariklia Deligianni, Bruce B. Doris, Damon B. Farmer, Steven J. Holmes, Qinghuang Lin +2 more | 2020-06-16 |
| 10669153 | Neuro-chemical sensor with selectively permeable membrane on nano-electrode | Steven J. Holmes, Emily R. Kinser, Qinghuang Lin, Nathan P. Marchack | 2020-06-02 |
| 10651086 | 3D integration method using SOI substrates and structures produced thereby | Sampath Purushothaman | 2020-05-12 |
| 10618806 | Neuro-chemical sensor with selectively permeable membrane on nano-electrode | Steven J. Holmes, Emily R. Kinser, Qinghuang Lin, Nathan P. Marchack | 2020-04-14 |
| 10610621 | Antibacterial medical implant surface | Stacey Gifford, Huan Hu, Emily R. Kinser, Sufi Zafar | 2020-04-07 |
| 10583471 | Neuro-chemical sensor with inhibition of fouling on nano-electrode | Steven J. Holmes, Emily R. Kinser, Qinghuang Lin, Nathan P. Marchack | 2020-03-10 |
| 10585060 | On-chip biosensors with nanometer scale glass-like carbon electrodes and improved adhesive coupling | Hariklia Deligianni, Bruce B. Doris, Damon B. Farmer, Steven J. Holmes, Qinghuang Lin +2 more | 2020-03-10 |
| 10583282 | Neuro-stem cell stimulation and growth enhancement with implantable nanodevice | Steven J. Holmes, Qinghuang Lin, Emily R. Kinser, Nathan P. Marchack | 2020-03-10 |
| 10216008 | Saccade and vergence tracking for distance auto focus adjustment | Emily R. Kinser, John U. Knickerbocker | 2019-02-26 |
| 10168550 | Saccade and vergence tracking for distance auto focus adjustment | Emily R. Kinser, John U. Knickerbocker | 2019-01-01 |
| 10067061 | Patch clamp technique with complementary raman spectroscopy | Emily R. Kinser | 2018-09-04 |
| 9994741 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Sampath Purushothaman, Mary E. Rothwell +1 more | 2018-06-12 |
| 9995686 | Patch clamp technique with complementary Raman spectroscopy | Emily R. Kinser | 2018-06-12 |
| 9583410 | Volumetric integrated circuit and volumetric integrated circuit manufacturing method | Daniel C. Edelstein, Michael A. Gaynes, Thomas M. Shaw, Bucknell C. Webb | 2017-02-28 |
| 9111925 | Process for enhanced 3D integration and structures generated using the same | Evan G. Colgan, Sampath Purushothaman | 2015-08-18 |
| 9064717 | Lock and key through-via method for wafer level 3D integration and structures produced thereby | Sampath Purushothaman, Mary E. Rothwell, Ghavam G. Shahidi | 2015-06-23 |
| 8968583 | Cleaning process for microelectronic dielectric and metal structures | Mary B. Rothwell | 2015-03-03 |
| 8569874 | High memory density, high input/output bandwidth logic-memory structure and architecture | Evan G. Colgan, Monty M. Denneau, Sampath Purushothaman, Klmberley A. Kelly | 2013-10-29 |
| 8563396 | 3D integration method using SOI substrates and structures produced thereby | Sampath Purushothaman | 2013-10-22 |
| 8476753 | Process for enhanced 3D integration and structures generated using the same | Evan G. Colgan, Sampath Purushothaman | 2013-07-02 |
| 8330262 | Processes for enhanced 3D integration and structures generated using the same | Evan G. Colgan, Sampath Purushothaman | 2012-12-11 |
| 8093099 | Lock and key through-via method for wafer level 3D integration and structures produced | Sampath Purushothaman, Mary E. Rothwell, Ghavam G. Shahidi | 2012-01-10 |
| 7994639 | Microelectronic structure including dual damascene structure and high contrast alignment mark | James J. Bucchignano, Gerald W. Gibson, Mary B. Rothwell | 2011-08-09 |
| 7855455 | Lock and key through-via method for wafer level 3 D integration and structures produced | Sampath Purushothaman, Mary E. Rothwell, Ghavam G. Shahidi | 2010-12-21 |
| 7695897 | Structures and methods for low-k or ultra low-k interlayer dielectric pattern transfer | James J. Bucchignano, Gerald W. Gibson, Mary B. Rothwell | 2010-04-13 |