Issued Patents All Time
Showing 51–75 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8847325 | Fin field-effect transistor structure | Teng-Chun Tsai, Chun-Yuan Wu, Chih-Chien Liu, Chin-Cheng Chien | 2014-09-30 |
| 8847146 | Image sensor package structure with casing including a vent without sealing and in communication with package material | Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon Ho +2 more | 2014-09-30 |
| 8841733 | Semiconductor device and method of fabricating the same | Hsin-Fu Huang, Kun-Hsien Lin, Chi-Mao Hsu, Min-Chuan Tsai, Tzung-Ying Lee | 2014-09-23 |
| 8836049 | Semiconductor structure and process thereof | Min-Chuan Tsai, Hsin-Fu Huang, Chi-Mao Hsu, Chien-Hao Chen, Wei-Yu Chen +3 more | 2014-09-16 |
| 8822336 | Through-silicon via forming method | Teng-Chun Tsai, Chun-Yuan Wu, Chih-Chien Liu, Chin-Cheng Chien | 2014-09-02 |
| 8822284 | Method for fabricating FinFETs and semiconductor structure fabricated using the method | Chin-Cheng Chien, Chun-Yuan Wu, Teng-Chun Tsai, Chih-Chien Liu | 2014-09-02 |
| 8815703 | Fabricating method of shallow trench isolation structure | Liang-An Huang, Yu-Chun Huang, Yu-Ciao Lin, Yu-Chieh Lin, Hsin-Liang Liu +3 more | 2014-08-26 |
| 8779513 | Non-planar semiconductor structure | Shih-Hung Tsai, Chien-Ting Lin, Chin-Cheng Chien, Chih-Chien Liu, Teng-Chun Tsai +1 more | 2014-07-15 |
| 8735269 | Method for forming semiconductor structure having TiN layer | Chi-Yuan Sun, Chien-Hao Chen, Hsin-Fu Huang, Min-Chuan Tsai, Wei-Yu Chen +2 more | 2014-05-27 |
| 8691681 | Semiconductor device having a metal gate and fabricating method thereof | Chi-Mao Hsu, Hsin-Fu Huang, Min-Chuan Tsai, Wei-Yu Chen, Chien-Hao Chen | 2014-04-08 |
| 8669618 | Manufacturing method for semiconductor device having metal gate | Ssu-I Fu, Wen-Tai Chiang, Ying-Tsung Chen, Shih-Hung Tsai, Chien-Ting Lin +1 more | 2014-03-11 |
| 8664055 | Fin field-effect transistor structure and manufacturing process thereof | Teng-Chun Tsai, Chun-Yuan Wu, Chih-Chien Liu, Chin-Cheng Chien | 2014-03-04 |
| 8647941 | Method of forming semiconductor device | Chin-Cheng Chien, Chun-Yuan Wu, Chih-Chien Liu, Teng-Chun Tsai | 2014-02-11 |
| 8647989 | Method of forming opening on semiconductor substrate | Chun-Yuan Wu, Chih-Chien Liu, Po-Chun Chen | 2014-02-11 |
| 8609529 | Fabrication method and structure of through silicon via | Chun-Yuan Wu, Chih-Chien Liu, Teng-Chun Tsai, Chin-Cheng Chien | 2013-12-17 |
| 8551829 | Method for manufacturing multi-gate transistor device | Chin-Cheng Chien, Chun-Yuan Wu, Chih-Chien Liu, Teng-Chun Tsai | 2013-10-08 |
| 8530980 | Gate stack structure with etch stop layer and manufacturing process thereof | Kun-Hsien Lin, Hsin-Fu Huang, Chi-Mao Hsu, Chun-Yuan Wu | 2013-09-10 |
| 8497198 | Semiconductor process | Chin-Cheng Chien, Chun-Yuan Wu, Chih-Chien Liu, Teng-Chun Tsai | 2013-07-30 |
| 8481343 | Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same | Chung-Hsien Hsin, Hsiu-Wen Tu, Chun-Hua Chuang, Ren-Long Kuo, Young-Houng Shiao | 2013-07-09 |
| 8481425 | Method for fabricating through-silicon via structure | Yen-Liang Lu, Chun-Ling Lin, Chi-Mao Hsu, Chun-Hung Chen, Tsun-Min Cheng +1 more | 2013-07-09 |
| 8476164 | Method of manufacturing semiconductor device with silicide | Chin-Cheng Chien, Chih-Chien Liu, Chia-Lin Hsu, Chun-Yuan Wu | 2013-07-02 |
| 8441072 | Non-planar semiconductor structure and fabrication method thereof | Shih-Hung Tsai, Chien-Ting Lin, Chin-Cheng Chien, Chih-Chien Liu, Teng-Chun Tsai +1 more | 2013-05-14 |
| 8441086 | Image sensor packaging structure with predetermined focal length | Hsiu-Wen Tu, Chung-Hsien Hsin, Chun-Hua Chuang, Ren-Long Kuo, Young-Houng Shiao | 2013-05-14 |
| 8431473 | Method for fabricating semiconductor device | Shu-Hui Hu, Shih-Feng Su, Hui-Shen Shih, Chih-Chien Liu, Po-Chun Chen +2 more | 2013-04-30 |
| 8420544 | Method for fabricating interconnection structure with dry-cleaning process | Hsin-Fu Huang, Chi-Mao Hsu, Tsun-Min Cheng | 2013-04-16 |