Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8456017 | Filled through-silicon via with conductive composite material | Ming-Ji Dai, Heng-Chieh Chien, Ming-Che Hsieh, Jui-Feng Hung, Ra-Min Tain | 2013-06-04 |
| 8397584 | Fabricating method and testing method of semiconductor device and mechanical integrity testing apparatus | Ming-Che Hsieh, Ra-Min Tain | 2013-03-19 |
| 6299058 | Positioning method for attaching a solder ball to an electrical connector and the connector using the same | Scott Lin, Ming-Lun Szu | 2001-10-09 |
| 6075710 | Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips | — | 2000-06-13 |
| 6057601 | Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrate | Tzyy-Jang Tseng, Chen-Hua Cheng | 2000-05-02 |
| 5825084 | Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices | Yung-Shih Chen, Tai-Yu Chou, Frank H. Wu, Kuan L. Chen, Wei Koh | 1998-10-20 |
| 4752946 | Gas discharge derived annular plasma pinch x-ray source | Rajendra P. Gupta, Mladen M. Kekez, Gary D. Lougheed | 1988-06-21 |
| 4751723 | Multiple vacuum arc derived plasma pinch x-ray source | Rajendra P. Gupta, Mladen M. Kekez, Gary D. Lougheed | 1988-06-14 |