JA

Junichi Aoki

TI Toray Industries: 10 patents #203 of 3,690Top 6%
SC Semiconductor Process Laboratory Co.: 6 patents #9 of 32Top 30%
Canon: 6 patents #8,497 of 19,416Top 45%
Sharp Kabushiki Kaisha: 2 patents #5,184 of 10,731Top 50%
FI Fujifilm Business Innovation: 2 patents #2,833 of 5,238Top 55%
ME Meidensha: 2 patents #147 of 555Top 30%
NE Nec Electronics: 2 patents #384 of 1,789Top 25%
KC Koki Holdings Co.: 2 patents #85 of 215Top 40%
IBM: 1 patents #44,794 of 70,183Top 65%
SO Sony: 1 patents #17,262 of 25,231Top 70%
Nissan Motor Co.: 1 patents #4,519 of 8,689Top 55%
Overall (All Time): #129,932 of 4,157,543Top 4%
29
Patents All Time

Issued Patents All Time

Showing 25 most recent of 29 patents

Patent #TitleCo-InventorsDate
11806899 Method for producing prepreg and method for producing fiber-reinforced composite material Takashi Ochi, So Nishino, Satoshi Enzaki, Takaaki Yamashita 2023-11-07
11566117 Production method for prepreg, prepreg tape, and fiber reinforced composite material, and coating device Takashi Ochi, So Nishino, Yoshikazu Kono, Tamotsu Suzuki, Takashi Ikushima 2023-01-31
11499025 Prepreg manufacturing method and manufacturing apparatus So Nishino, Yoshikazu Kono, Takashi Ochi, Yoshiyuki Kitamura, Kiyoshi Minoura 2022-11-15
11491685 Production method for prepreg, prepreg tape, and fiber reinforced composite material, and prepreg production device Takashi Ochi, Yoshikazu Kono, So Nishino, Kiyoshi Minoura, Tamotsu Suzuki 2022-11-08
11224993 Production method and coating device for coating-liquid-impregnated sheet-like reinforcing-fiber bundle and sheet-like integrated object Takashi Ochi, So Nishino, Tamotsu Suzuki 2022-01-18
11208535 Production method for prepreg, and production method for fiber-reinforced composite material Takashi Ochi, Takaaki Yamashita 2021-12-28
11192280 Coating-liquid-impregnated fiber-reinforced fabric, sheet-shaped integrated object, prepreg, prepreg tape, and method for manufacturing fiber-reinforced composite material Takashi Ochi, So Nishino, Tamotsu Suzuki 2021-12-07
11034810 Epoxy resin composition, prepreg, and carbon fiber-reinforced composite material Koji Furukawa, Atsuhito Arai, Jun Misumi, Hiroaki Sakata, Takashi Ochi 2021-06-15
10851217 Epoxy resin composition, prepreg, and carbon fiber reinforced composite material Koji Furukawa, Kyoko Tamaru, Atsuhito Arai, Hiroaki Sakata, Takashi Ochi 2020-12-01
10702956 Flux activator, flux, and solder Kazuhiro Yukikata, Yuusuke Sato, Mitsuyasu Furusawa, Kimiaki Mori 2020-07-07
10280251 Epoxy resin composition, prepreg, and carbon fiber-reinforced composite material Atsuhito Arai, Hiroaki Sakata, Takashi Ochi 2019-05-07
10027241 Vehicle-mounted power conversion device 2018-07-17
9609762 Flux, solder composition, and method for manufacturing electronic circuit mounted substrate Kenji Arai, Mitsuyasu Furusawa, Mayumi Takada, Munehiko Nakatsuma 2017-03-28
9467017 Inter-phase insulation sheet for rotating electric machine Takeshi Suwazono 2016-10-11
8331831 Developer container package body and package container Naoto Yamada 2012-12-11
7876369 Image processing apparatus, image processing method, and program 2011-01-25
7566007 Physical distribution management system and method for customized products Toshio Watanabe, Noriko Torigoe 2009-07-28
7478130 Message processing apparatus, method and program Yoshiaki Kobayashi, Hiroyuki Miyajima, Hideki Tai, Gaku Yamamoto 2009-01-13
6937065 Level shelter, semiconductor integrated circuit and information processing system 2005-08-30
6850090 Level shifter 2005-02-01
6835669 Film forming method, semiconductor device and semiconductor device manufacturing method Taizo Oku, Youichi Yamamoto, Takashi Koromokawa, Kazuo Maeda 2004-12-28
6646327 Semiconductor device and semiconductor device manufacturing method Taizo Oku, Youichi Yamamoto, Takashi Koromokawa 2003-11-11
6500752 Semiconductor device and semiconductor device manufacturing method Taizo Oku, Youichi Yamamoto, Takashi Koromokawa, Kazuo Maeda 2002-12-31
6420276 Semiconductor device and semiconductor device manufacturing method Taizo Oku, Youichi Yamamoto, Takashi Koromokawa, Kazuo Maeda 2002-07-16
6133162 Method of forming a film by using plasmanized process gas containing gaseous H.sub.2 O and an auxiliary gas in a semiconductor device Setsu Suzuki, Kazuo Maeda 2000-10-17