Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9609762 | Flux, solder composition, and method for manufacturing electronic circuit mounted substrate | Kenji Arai, Mitsuyasu Furusawa, Junichi Aoki, Munehiko Nakatsuma | 2017-03-28 |
| 5713578 | Hydraulic sealing device | Kiminobu Terao, Kouji Ueda, Kenji Amano | 1998-02-03 |
| 5660398 | Hydraulic sealing device | Kiminobu Terao, Yorinori Kumagai, Takamichi Shimada, Toshio Oka, Junya Nagai | 1997-08-26 |