Issued Patents All Time
Showing 76–100 of 111 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D770549 | Linear actuator | — | 2016-11-01 |
| D770548 | Linear actuator | — | 2016-11-01 |
| D767655 | Linear actuator | — | 2016-09-27 |
| D767002 | Linear actuator | — | 2016-09-20 |
| D767003 | Linear actuator | — | 2016-09-20 |
| D767004 | Linear actuator | — | 2016-09-20 |
| D767001 | Linear actuator | — | 2016-09-20 |
| D767000 | Linear actuator | — | 2016-09-20 |
| D766999 | Linear actuator | — | 2016-09-20 |
| 9425290 | Formation of high quality fin in 3D structure by way of two-step implantation | Chun-Feng Nieh, Hsin-Wei Wu, Tsun-Jen Chan | 2016-08-23 |
| 9337059 | Apparatus and methods for annealing wafers | Yi-Chao Wang, Li-Ting Wang, Tai-Chun Huang, Pei-Ren Jeng, Tze-Liang Lee | 2016-05-10 |
| 9252271 | Semiconductor device and method of making | Wen-Tai Lu, Hou-Yu Chen, Chun-Feng Nieh | 2016-02-02 |
| 9123564 | Semiconductor device with conformal doping and method of making | Wen-Tai Lu, Li-Ting Wang, Chun-Feng Nieh, Hou-Yu Chen, Huicheng Chang | 2015-09-01 |
| 9099495 | Formation of high quality fin in 3D structure by way of two-step implantation | Chun-Feng Nieh, Hsin-Wei Wu, Tsun-Jen Chan | 2015-08-04 |
| 8994155 | Packaging devices, methods of manufacture thereof, and packaging methods | Tsung-Fu Tsai, Ying-Ching Shih, Wei Wu, Yian-Liang Kuo, Chia-Wei Tu | 2015-03-31 |
| D702271 | Linear actuator | — | 2014-04-08 |
| 8058134 | Junction profile engineering using staged thermal annealing | Li-Ting Wang, Keh-Chiang Ku, Nai-Han Cheng, Li-Ping Huang | 2011-11-15 |
| 7736968 | Reducing poly-depletion through co-implanting carbon and nitrogen | Keh-Chiang Ku, Cheng-Lung Hung, Li-Ting Wang, Chien-Hao Chen, Chien-Hao Huang +1 more | 2010-06-15 |
| 7672101 | ESD protection circuit and method | Shu-Huei Lin, Chong-Gim Gan, Yi-Hsun Wu | 2010-03-02 |
| 7652290 | Standby current erasion circuit of DRAM | — | 2010-01-26 |
| 7443171 | Devices and methods for detecting current leakage between deep trench capacitors in DRAM devices | — | 2008-10-28 |
| 7439751 | Apparatus and method for testing conductive bumps | Yian-Liang Kuo, Yu-Ting Lin | 2008-10-21 |
| 7372153 | Integrated circuit package bond pad having plurality of conductive members | Yian-Liang Kuo | 2008-05-13 |
| 7348596 | Devices for detecting current leakage between deep trench capacitors in DRAM devices | — | 2008-03-25 |
| 7342835 | Memory device with pre-fetch circuit and pre-fetch method | Ying-Te Tu | 2008-03-11 |