Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432977 | Semiconductor device and method for manufacturing the same | Shuen-Shin Liang, Min-Chiang Chuang, Chia-Cheng Chen, Chun-Hung Wu, Liang-Yin Chen +12 more | 2025-09-30 |
| 10522427 | Techniques providing semiconductor wafer grouping in a feed forward process | Yh-Hsiu Hsiao, Lu Cheng-Ta, Jian Wu | 2019-12-31 |
| 10049856 | High temperature intermittent ion implantation | Hsin-Wei Wu, Chun-Feng Nieh, Yu Chi-Fu, Hsing-Jui Lee | 2018-08-14 |
| 9982338 | High-throughput system and method for post-implantation single wafer warm-up | Cheng-Hung Hu, Yi-Hann Chen, Kang Hua Chang, Ming-Te Chen | 2018-05-29 |
| 9663854 | High-throughput system and method for post-implantation single wafer warm-up | Cheng-Hung Hu, Yi-Hann Chen, Kang Hua Chang, Ming-Te Chen | 2017-05-30 |
| 9634126 | Formation of high quality Fin in 3D structure by way of two-step implantation | Chun-Feng Nieh, Hsin-Wei Wu, Yu-Chang Lin | 2017-04-25 |
| 9425290 | Formation of high quality fin in 3D structure by way of two-step implantation | Chun-Feng Nieh, Hsin-Wei Wu, Yu-Chang Lin | 2016-08-23 |
| 9343312 | High temperature intermittent ion implantation | Hsin-Wei Wu, Chun-Feng Nieh, Hsing-Jui Lee, Yu-Chi Fu | 2016-05-17 |
| 9099495 | Formation of high quality fin in 3D structure by way of two-step implantation | Chun-Feng Nieh, Hsin-Wei Wu, Yu-Chang Lin | 2015-08-04 |