Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9982338 | High-throughput system and method for post-implantation single wafer warm-up | Tsun-Jen Chan, Cheng-Hung Hu, Yi-Hann Chen, Ming-Te Chen | 2018-05-29 |
| 9663854 | High-throughput system and method for post-implantation single wafer warm-up | Tsun-Jen Chan, Cheng-Hung Hu, Yi-Hann Chen, Ming-Te Chen | 2017-05-30 |