CH

Cheng-Hung Hu

TSMC: 3 patents #5,465 of 12,232Top 45%
Overall (All Time): #1,478,518 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9982338 High-throughput system and method for post-implantation single wafer warm-up Tsun-Jen Chan, Yi-Hann Chen, Kang Hua Chang, Ming-Te Chen 2018-05-29
9663854 High-throughput system and method for post-implantation single wafer warm-up Tsun-Jen Chan, Yi-Hann Chen, Kang Hua Chang, Ming-Te Chen 2017-05-30
9196452 Methods and apparatus for carbon ion source head Yi-Jiun Lee, Yh-Hsiu Hsiao, Kan Hwa Chang, Ming-Te Chen 2015-11-24