Issued Patents All Time
Showing 51–67 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6559050 | Process for high thermal stable contact formation in manufacturing sub-quarter-micron CMOS devices | William R. McKee, Ming-Jang Hwang, Dirk N. Anderson, Wei William Lee | 2003-05-06 |
| 6544886 | Process for isolating an exposed conducting surface | Qi-Zhong Hong, Duane E. Carter, Yung Liu | 2003-04-08 |
| 6451677 | Plasma-enhanced chemical vapor deposition of a nucleation layer in a tungsten metallization process | Boyang Lin, Wei-Yung Hsu | 2002-09-17 |
| 6451646 | High-k dielectric materials and processes for manufacturing them | Ming-Jang Hwang | 2002-09-17 |
| 6365517 | Process for depositing thin films containing titanium and nitrogen | Ming-Jang Hwang | 2002-04-02 |
| 6265303 | Integrated circuit dielectric and method | Changming Jin | 2001-07-24 |
| 6245672 | Method of forming diffusion barriers for copper metallization in integrated cirucits | Qi-Zhong Hong, Wei-Yung Hsu, Robert H. Havemann | 2001-06-12 |
| 6218732 | Copper bond pad process | Stephen W. Russell | 2001-04-17 |
| 6187656 | CVD-based process for manufacturing stable low-resistivity poly-metal gate electrodes | Ming-Jang Hwang, Dirk N. Anderson, Jorge A. Kittl, Hun-Lian Tsai | 2001-02-13 |
| 6184129 | Low resistivity poly-silicon gate produced by selective metal growth | Ming-Jang Hwang, Duane E. Carter, Wei-Yung Hsu | 2001-02-06 |
| 6120842 | TiN+Al films and processes | Wei-Yung Hsu, Qi-Zhong Hong | 2000-09-19 |
| 6100188 | Stable and low resistance metal/barrier/silicon stack structure and related process for manufacturing | Ming-Jang Hwang, Dick N. Anderson, Duane E. Carter, Wei-Yung Hsu | 2000-08-08 |
| 6093642 | Tungsten-nitride for contact barrier application | Chih-Chen Cho, Yoshimitsu Tamura | 2000-07-25 |
| 6037013 | Barrier/liner with a SiNx-enriched surface layer on MOCVD prepared films | Wei-Yung Hsu, Qi-Zhong Hong | 2000-03-14 |
| 6017818 | Process for fabricating conformal Ti-Si-N and Ti-B-N based barrier films with low defect density | — | 2000-01-25 |
| 6008540 | Integrated circuit dielectric and method | Changming Jin | 1999-12-28 |
| 5913145 | Method for fabricating thermally stable contacts with a diffusion barrier formed at high temperatures | Chih-Chen Cho | 1999-06-15 |