ZW

Zhiqiang Wu

TSMC: 183 patents #90 of 12,232Top 1%
Micron: 58 patents #293 of 6,345Top 5%
TI Texas Instruments: 29 patents #346 of 12,488Top 3%
SS Sap Se: 6 patents #534 of 6,322Top 9%
SC Shanghai Bilibili Technology Co.: 5 patents #11 of 198Top 6%
SC Shenzhen Lingke Technology Co.: 5 patents #1 of 4Top 25%
HC Hangzhou Qulian Technology Co.: 2 patents #7 of 18Top 40%
EC Ecovacs Robotics Co.: 1 patents #29 of 47Top 65%
SU Southwest Jiaotong University: 1 patents #66 of 321Top 25%
SC Sz Dji Technology Co.: 1 patents #426 of 680Top 65%
XU Xi'An Jiaotong University: 1 patents #201 of 791Top 30%
HC Hangzhou Biotest Biotech Co.: 1 patents #15 of 20Top 75%
HC Hunan Sany Intelligent Control Equipment Co.: 1 patents #8 of 39Top 25%
JS Johnson Electric S.A.: 1 patents #231 of 526Top 45%
📍 Zhubeikou, ID: #1 of 2 inventorsTop 50%
Overall (All Time): #1,228 of 4,157,543Top 1%
306
Patents All Time

Issued Patents All Time

Showing 276–300 of 306 patents

Patent #TitleCo-InventorsDate
6335234 Methods of forming field effect transistors and related field effect transistor constructions Paul Hatab 2002-01-01
6335246 Methods of forming field effect transistors and related field effect transistor constructions Paul Hatab 2002-01-01
6331720 Electrically conductive structure Kunal R. Parekh, Li Li 2001-12-18
6309975 Methods of making implanted structures Li Li, Thomas A. Figura, Kunal R. Parekh, Pai-Hung Pan, Alan R. Reinberg +1 more 2001-10-30
6303434 Method of forming an electrically conductive structure such as a capacitor Kunal R. Parekh, Li Li 2001-10-16
6274482 Semiconductor processing methods of forming a contact opening Alan R. Reinberg, Manny K. F. Ma 2001-08-14
6264486 Zero insertion force sockets using negative thermal expansion materials Tongbi Jiang 2001-07-24
6261964 Material removal method for forming a structure Li Li, Thomas A. Figura, Kunal R. Parekh, Pai-Hung Pan, Alan R. Reinberg +1 more 2001-07-17
6244498 Ultrasonic vibration mode for wire bonding Tongbi Jiang 2001-06-12
6245594 Methods for forming conductive micro-bumps and recessed contacts for flip-chip technology and method of flip-chip assembly Tongbi Jiang, Salman Akram 2001-06-12
6191047 Etching process using a buffer layer Li Li, Kunal R. Parekh 2001-02-20
6146961 Processing methods of forming a capacitor Thomas M. Graettinger, Paul J. Schuele, Pierre C. Fazan, Li Li, Kunal R. Parekh +1 more 2000-11-14
6127287 Silicon nitride deposition method for use in forming a memory cell dielectric Kelly Hurley, Li Li, Pierre C. Fazan 2000-10-03
6110789 Contact formation using two anneal steps Howard E. Rhodes, Philip J. Ireland, Kenneth N. Hagen 2000-08-29
6077790 Etching process using a buffer layer Li Li, Kunal R. Parekh 2000-06-20
6073497 High resolution pressure sensing device having an insulating flexible matrix loaded with filler particles Tongbi Jiang 2000-06-13
6075274 Semiconductor devices having gate stack with improved sidewall integrity Pai-Hung Pan 2000-06-13
6049101 Processing methods of forming a capacitor, and capacitor construction Thomas M. Graettinger, Paul J. Schuele, Pierre C. Fazan, Li Li, Kunal R. Parekh +1 more 2000-04-11
6043119 Method of making a capacitor Kunal R. Parekh, Li Li 2000-03-28
6027967 Method of making a fin-like stacked capacitor Kunal R. Parekh, Li Li 2000-02-22
6025232 Methods of forming field effect transistors and related field effect transistor constructions Paul Hatab 2000-02-15
6013557 Advanced CMOS isolation utilizing enhanced oxidation by light ion implantation Li Li 2000-01-11
6011307 Anisotropic conductive interconnect material for electronic devices, method of use and resulting product Tongbi Jiang, David Y. Kao, Rongsheng Yang 2000-01-04
6010949 Method for removing silicon nitride in the fabrication of semiconductor devices Li Li, Richard C. Hawthorne, Elvia M. Hawthorne 2000-01-04
5998290 Method to protect gate stack material during source/drain reoxidation Pai-Hung Pan 1999-12-07