Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10720526 | Stress modulation for dielectric layers | Chung-Ting Ko, Han-Chi Lin, Chunyao Wang, Ching-Yu Huang, Tze-Liang Lee | 2020-07-21 |
| 10700005 | Interconnect structure with air gaps | Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin | 2020-06-30 |
| 10642322 | Heat dissipation module | Cheng-Wen Hsieh, Wen-Neng Liao | 2020-05-05 |
| 10634435 | Thermal dissipation module | Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh | 2020-04-28 |
| 10637470 | Optical keyswitch | Yu-Chun Hsieh, Chen Yang, Chia-Hung Liu | 2020-04-28 |
| 10622453 | Vertical MOS transistor | Tai-I Yang, Shin-Yi Yang, Chih Wei Lu, Hsin-Ping Chen, Shau-Lin Shue | 2020-04-14 |
| 10572018 | Keyswitch with adjustable tactile feedback | Chen Yang, Chia-Hung Liu, Yu-Chun Hsieh | 2020-02-25 |
| 10563926 | Lattice boiler evaporator | Cheng-Wen Hsieh, Wen-Neng Liao, Jau-Han Ke | 2020-02-18 |
| 10535477 | Button switch and keyswitch thereof | Yu-Chun Hsieh, Chen Yang, Chia-Hung Liu, Yen-Hsiao Lin | 2020-01-14 |
| 10490500 | Metal line structure and method | Hsiang-Lun Kao, Hsiang-Wei Liu, Tai-I Yang, Jian-Hua Chen, Yu-Chieh Liao +1 more | 2019-11-26 |
| 10431402 | Button switch with adjustable tactile feedback | Yu-Chun Hsieh, Chia-Hung Liu, Chen Yang | 2019-10-01 |
| 10325993 | Gate all around device and fabrication thereof | Yu-Chieh Liao, Tai-I Yang, Hsin-Ping Chen | 2019-06-18 |
| 10303212 | Rotary combination module for tablet computer | Jian Wang, Cheng-Mao Chang, Wen-Neng Liao | 2019-05-28 |
| 10276498 | Interconnect structure with air-gaps | Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin | 2019-04-30 |
| 10269915 | Vertical MOS transistor and fabricating method thereof | Tai-I Yang, Shin-Yi Yang, Chih Wei Lu, Hsin-Ping Chen, Shau-Lin Shue | 2019-04-23 |
| 10209744 | Portable electronic device | Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh | 2019-02-19 |
| 10114434 | Heat dissipation module and electronic device | Wen-Neng Liao, Cheng-Wen Hsieh | 2018-10-30 |
| 10109519 | Method of semiconductor integrated circuit fabrication | Hsiang-Lun Kao, Tien-Lu Lin, Cheng-Chi Chuang | 2018-10-23 |
| 10032713 | Semiconductor device structure and method for forming the same | Carlos H. Diaz, Tien-Lu Lin | 2018-07-24 |
| 10006471 | Fan module and electronic device using the same | Cheng-Wen Hsieh, Kuang-Hua Lin, Cheng-Yu Cheng, Wen-Neng Liao | 2018-06-26 |
| 9875967 | Interconnect structure with air-gaps | Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin | 2018-01-23 |
| 9835382 | Thermal dissipation module | Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh | 2017-12-05 |
| 9837307 | Semiconductor device and process | Hsiang-Lun Kao, Tien-Lu Lin, Yu-Chieh Liao | 2017-12-05 |
| 9716035 | Combination interconnect structure and methods of forming same | Tai-I Yang, Cheng-Chi Chuang, Chia-Tien Wu, Tien-Lu Lin | 2017-07-25 |
| 9633897 | Air-gap forming techniques for interconnect structures | Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin | 2017-04-25 |