Issued Patents All Time
Showing 51–56 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583434 | Metal line structure and method | Hsiang-Lun Kao, Hsiang-Wei Liu, Tai-I Yang, Jian-Hua Chen, Yu-Chieh Liao +1 more | 2017-02-28 |
| 9564396 | Semiconductor device and process | Hsiang-Lun Kao, Tien-Lu Lin, Yu-Chieh Liao | 2017-02-07 |
| 9455178 | Method of semiconductor integrated circuit fabrication | Hsiang-Lun Kao, Tien-Lu Lin, Cheng-Chi Chuang | 2016-09-27 |
| 9390965 | Air-gap forming techniques for interconnect structures | Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin | 2016-07-12 |
| 8975749 | Method of making a semiconductor device including barrier layers for copper interconnect | Nai-Wei Liu, Zhen-Cheng Wu, Cheng-Lin Huang, Po-Hsiang Huang, Shu-Hui Su +2 more | 2015-03-10 |
| 8653664 | Barrier layers for copper interconnect | Nai-Wei Liu, Zhen-Cheng Wu, Cheng-Lin Huang, Po-Hsiang Huang, Shu-Hui Su +2 more | 2014-02-18 |