Issued Patents All Time
Showing 101–125 of 217 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133255 | Metal patterning for internal cell routing | Shih-Wei Peng, Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng | 2021-09-28 |
| 11126775 | IC layout, method, device, and system | Shih-Wei Peng, Guo-Huei Wu, Hui-Zhong Zhuang, Jiann-Tyng Tzeng | 2021-09-21 |
| 11121256 | Semiconductor device integrating backside power grid and related integrated circuit and fabrication method | Chih-Liang Chen, Lei-Chun Chou, Jack Liu, Kam-Tou Sio, Hui-Ting Yang +3 more | 2021-09-14 |
| 11114934 | Power supply device and operation method thereof | Wei-Hsun Lai, Po-Cheng Chiu, Chien-Yu Wang | 2021-09-07 |
| 11101353 | Semiconductor device and method of manufacture | Chun-Hsien Huang, Chang-Ting Chung, Wei-Jung Lin, Chih-Wei Chang | 2021-08-24 |
| 11100273 | Integrated circuit and method of manufacturing same | Shih-Wei Peng, Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Zhong Zhuang, Jiann-Tyng Tzeng +1 more | 2021-08-24 |
| 11055469 | Power structure with power pick-up cell connecting to buried power rail | Shih-Wei Peng, Jiann-Tyng Tzeng | 2021-07-06 |
| 11043426 | Dummy MOL removal for performance enhancement | Hui-Ting Yang, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +4 more | 2021-06-22 |
| 11024580 | Random cut patterning | Shih-Wei Peng, Chih-Ming Lai, Jiann-Tyng Tzeng | 2021-06-01 |
| 11018157 | Local interconnect structure | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +5 more | 2021-05-25 |
| 11011989 | Power supply circuit and method of operation thereof | Wei-Hsun Lai, Chien-Yu Wang, Po-Cheng Chiu | 2021-05-18 |
| 10977417 | Semiconductor structure, device, and method | Shih-Wei Peng, Jiann-Tyng Tzeng | 2021-04-13 |
| 10977421 | System for and method of manufacturing an integrated circuit | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio +3 more | 2021-04-13 |
| 10964684 | Multiple fin height integrated circuit | Hui-Ting Yang, Jiann-Tyng Tzeng, Lipen Yuan, Wei-An Lai | 2021-03-30 |
| 10950456 | High-density semiconductor device | Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chin-Yuan Tseng +6 more | 2021-03-16 |
| 10951182 | Millimeter wave power amplifier circuit and millimeter wave power amplifier device | Shih-Hsiu Tseng, Chien-Jen Hsiao, Chung-Hsin Liu | 2021-03-16 |
| 10930595 | Standard cells having via rail and deep via structures | Cheng-Chi Chuang, Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Ting Yang, Wayne Lai | 2021-02-23 |
| 10879120 | Self aligned via and method for fabricating the same | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +4 more | 2020-12-29 |
| 10879173 | Middle-end-of-line strap for standard cell | Meng-Hung Shen, Chih-Liang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio | 2020-12-29 |
| 10878158 | Semiconductor device including cell region having more similar cell densities in different height rows, and method and system for generating layout diagram of same | Hui-Ting Yang, Jiann-Tyng Tzeng, Lipen Yuan, Wei-An Lai | 2020-12-29 |
| 10878161 | Method and structure to reduce cell width in integrated circuits | Shih-Wei Peng, Chih-Ming Lai, Jiann-Tyng Tzeng | 2020-12-29 |
| 10878162 | Metal with buried power for increased IC device density | Shih-Wei Peng, Chih-Ming Lai, Hui-Ting Yang, Jiann-Tyng Tzeng | 2020-12-29 |
| 10867917 | Semiconductor device, associated method and layout | Shih-Wei Peng, Hui-Ting Yang, Jiann-Tyng Tzeng | 2020-12-15 |
| 10868008 | Double rule integrated circuit layouts for a dual transmission gate | Shih-Wei Peng, Hui-Zhong Zhuang, Jiann-Tyng Tzeng, Li-Chun Tien, Pin-Dai Sue | 2020-12-15 |
| 10867102 | Inverted pitch IC structure, layout method, and system | Shih-Wei Peng, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng | 2020-12-15 |