Issued Patents All Time
Showing 26–50 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10192918 | Image sensor including dual isolation and method of making the same | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang | 2019-01-29 |
| 10181491 | Semiconductor image sensor device having back side illuminated image sensors with embedded color filters | Chiu-Jung Chen, Chun-Hao Chou, Hsin-Chi Chen, Kuo-Cheng Lee, Yung-Lung Hsu +1 more | 2019-01-15 |
| 10163966 | Image sensing device and manufacturing method thereof | Yun-Wei Cheng, Tsung-Han Tsai, Chun-Hao Chou, Kuo-Cheng Lee, Yung-Lung Hsu | 2018-12-25 |
| 10157950 | Pixel with spacer layer covering photodiode | Kuo-Hung Lee, Chia-Pin Cheng, Fu-Cheng Chang, Ching-Hung Kao | 2018-12-18 |
| 10056316 | Manufacuting method of semiconductor structure | Tsung-Han Tsai, Yung-Lung Hsu, Chung-Bin Tseng, Keng-Ying Liao, Po-Zen Chen | 2018-08-21 |
| 10056426 | Apparatus and method for fabricating a light guiding grid | Yun-Wei Cheng, I-I Cheng, Chi-Cherng Jeng | 2018-08-21 |
| 9887225 | Pixel with spacer layer covering photodiode | Kuo-Hung Lee, Chia-Pin Cheng, Fu-Cheng Chang, Ching-Hung Kao | 2018-02-06 |
| 9831154 | Semiconductor structure and manufacuting method of the same | Tsung-Han Tsai, Yung-Lung Hsu, Chung-Bin Tseng, Keng-Ying Liao, Po-Zen Chen | 2017-11-28 |
| 9825085 | Formation of buried color filters in a back side illuminated image sensor using an etching-stop layer | Yun-Wei Cheng, Chen Chiu-Jung, Kuo-Cheng Lee, Yung-Lung Hsu, Chen Hsin-Chi | 2017-11-21 |
| 9812492 | Metal shield structure and methods for BSI image sensors | Shiu-Ko JangJian, Chi-Cherng Jeng, Ying-Lang Wang | 2017-11-07 |
| 9786710 | Image sensor device with sub-isolation in pixels | Su-Hua Chang, Yung-Lung Hsu | 2017-10-10 |
| 9786716 | Method of fabricating semiconductor image sensor device having back side illuminated image sensors with embedded color filters | Chiu-Jung Chen, Chun-Hao Chou, Hsin-Chi Chen, Kuo-Cheng Lee, Yung-Lung Hsu +1 more | 2017-10-10 |
| 9768221 | Pad structure layout for semiconductor device | Shang-Yen Wu, I-Chih Chen, Yi-Sheng Liu, Fu-Tsun Tsai, Chi-Cherng Jeng +1 more | 2017-09-19 |
| 9761622 | CMOS image sensor structure with crosstalk improvement | Yun-Wei Cheng, Chun-Hao Chou, Tsung-Han Tsai, Kuo-Cheng Lee, Yung-Lung Hsu | 2017-09-12 |
| 9728511 | Semiconductor wafer and semiconductor die | Hsi-Jung Wu, Ying-Lang Wang, Hsin-Chi Chen, Ying-Hao Chen, Hung-Ta Huang | 2017-08-08 |
| 9711468 | Bonding pad structure with dense via array | Tsung-Han Tsai, Jung-Chi Jeng, Yueh-Ching Chang, Huang-Ta Huang, Chi-Cherng Jeng | 2017-07-18 |
| 9659859 | Metal pad offset for multi-layer metal layout | I-Chih Chen, Ying-Hao Chen, Chi-Cherng Jeng, Fu-Tsun Tsai, Kun-Huei Lin | 2017-05-23 |
| 9640456 | Support structure for integrated circuitry | Yun-Wei Cheng, I-I Cheng, Shiu-Ko JangJian, Chi-Cherng Jeng, Chih-Mu Huang | 2017-05-02 |
| 9627426 | Image sensor device and method for forming the same | Yu-Heng Cheng, Fu-Tsun Tsai, Hsi-Jung Wu, Chi-Cherng Jeng | 2017-04-18 |
| 9591242 | Black level control for image sensors | Yun-Wei Cheng, Che-Min Lin, Shiu-Ko JangJian, Chi-Cherng Jeng, Chih-Mu Huang | 2017-03-07 |
| 9553118 | Formation of buried color filters in a back side illuminated image sensor using an etching-stop layer | Yun-Wei Cheng, Chiu-Jung Chen, Kuo-Cheng Lee, Yung-Lung Hsu, Hsin-Chi Chen | 2017-01-24 |
| 9548329 | Backside illuminated image sensor and method of manufacturing the same | Huan-En Lin, Shiu-Ko JangJian, Fu-Tsun Tsai, Yung-Lung Hsu, Chi-Cherng Jeng | 2017-01-17 |
| 9543353 | Formation of buried color filters in a back side illuminated image sensor with an ONO-like structure | Yun-Wei Cheng, Chiu-Jung Chen, Kuo-Cheng Lee, Yung-Lung Hsu, Hsin-Chi Chen | 2017-01-10 |
| 9543343 | Mechanisms for forming image sensor device | Yun-Wei Cheng, Shiu-Ko JangJian, Zhe-Ju Liu, Kuo-Cheng Lee, Chi-Cherng Jeng | 2017-01-10 |
| 9543352 | CMOS image sensor with embedded micro-lenses | Zen-Fong Huang, Chia-Yu Wei, Chi-Cherng Jeng, Hsin-Chi Chen | 2017-01-10 |