Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711468 | Bonding pad structure with dense via array | Tsung-Han Tsai, Jung-Chi Jeng, Volume Chien, Huang-Ta Huang, Chi-Cherng Jeng | 2017-07-18 |
| 9041204 | Bonding pad structure with dense via array | Tsung-Han Tsai, Jung-Chi Jeng, Volume Chien, Huang-Ta Huang, Chi-Cherng Jeng | 2015-05-26 |